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Wired circuit board and producing method thereof

a technology of wired circuit boards and wired components, which is applied in the direction of integrated arm assemblies, instruments, and record information storage, etc., can solve the problems of excessive etching of the lead portion covered with the covering layer, contamination, discoloration or dissolution of the conductive layer pattern, and achieve the effect of preventing the dissolution and discoloration caused by the etchant in the conductive pattern

Active Publication Date: 2009-11-19
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a wired circuit board and a method for producing it that can prevent contamination and discoloration caused by the etching process. The method includes steps of integrating a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion for controlling the penetration of an etchant into the conductive pattern. The regulation portion prevents dissolution and discoloration of the conductive pattern by delaying the penetration of the etchant. The wired circuit board includes a covering portion that allows the etchant to penetrate and contact the regulation portion, which prevents the etchant from penetrating into the conductive pattern. The etchant spreads along the width direction over the regulation portion, and the contact surface is dissolved, resulting in lower etching ability and less likely penetration in the opposite direction. The method and wired circuit board of the present invention provide an effective solution for preventing contamination and discoloration in the wired circuit board production process.

Problems solved by technology

However, in the method for producing the magnetic head suspension described in Japanese Unexamined Patent Publication No. 2002-20898 mentioned above, when the plating lead portion is etched, the plating lead portion covered with the covering layer may be excessively etched.
That is, the etchant dissolves the plating lead portion covered with the covering layer toward the conductive layer pattern side and further reaches the conductive layer pattern under the electrode pads, thereby disadvantageously causing contamination, discoloration, or dissolution of the conductive layer pattern.

Method used

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  • Wired circuit board and producing method thereof
  • Wired circuit board and producing method thereof
  • Wired circuit board and producing method thereof

Examples

Experimental program
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Effect test

first embodiment

[0056]FIG. 1 shows a plan view of a wired circuit board assembly sheet provided with a plurality of first embodiments of a wired circuit board according to the present invention, FIG. 2 shows a sectional view of the same taken along the line A-A of FIG. 1, FIG. 3 shows an enlarged plan view of a second plating lead of the wired circuit board shown in FIG. 1, FIG. 4 is a process diagram of a production method of the wired circuit board assembly sheet shown in FIG. 1, FIG. 5 shows a plan view of the wired circuit board assembly sheet in a production process in FIG. 4(c), FIG. 6 shows an enlarged plan view of the plating lead of the wired circuit board assembly sheet in a production process in FIG. 4(c), and FIG. 7 shows an enlarged plan view of the plating lead of the wired circuit board assembly sheet in a production process in FIG. 4(d).

[0057]To clearly illustrate a relative position of a conductive layer 4, an insulating cover layer 5 and a plating layer 12 are omitted in FIG. 1.

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second embodiment

[0159]FIG. 15 shows an enlarged plan view of a second plating lead of a second embodiment of a wired circuit board according to the present invention.

[0160]In the above description, the wide portion 11 is provided as a regulation portion. However, as shown in FIG. 11, for example, a bending portion 23 can be provided as the regulation portion.

[0161]In FIG. 15, the rear side portion 35 of the second plating lead 18 includes the narrow portion 10 and the bending portion 23.

[0162]The bending portion 23 is formed so as to bend in a direction of crossing the front-to-end direction. Specifically, the bending portion 23 is formed in a generally S-shape in plane view having a uniform width.

[0163]More specifically, the bending portion 23 integrally includes a first curve 31 which protrudes on one side in the widthwise direction and curves arcuately, and a second curve 32 which protrudes on the other side in the widthwise direction from the front end of the first curve 31 and curves arcuately...

third embodiment

[0184]The regulation portion is described as at least the wide portion 11 and as at least the bending portion 23 in the first and the second embodiment mentioned above, respectively. However, for example, the regulation portion can be both the wide portion 11 and the bending portion 23, though not shown.

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Abstract

A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead with the etchant while the regulation portion regulates the penetration of the etchant into the conductive pattern.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This patent application claims the benefit of U.S. Provisional Application No. 61 / 071,878, filed on May 22, 2008, and claims priority from Japanese Patent Application No. 2008-127234, filed on May 14, 2008, the contents of which are herein incorporated by reference in their entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a wired circuit board and a producing method thereof. More particularly, the present invention relates to a wired circuit board such as a suspension board with circuit, and a production method thereof.[0004]2. Description of Related Art[0005]In conventional production methods of wired circuit boards such as a suspension board with circuit, a gold plating layer is provided on a surface of a terminal portion of a conductive pattern. The gold plating layer is formed by electrolytic gold plating in which electric power is fed from feeding pads to the conductive pattern...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/11H05K3/02
CPCH05K1/056H05K1/117H05K3/06H05K2203/175H05K2201/09263H05K2201/09727H05K3/242G11B5/484
Inventor OHSAWA, TETSUYAOOYABU, YASUNARIISHII, JUN
Owner NITTO DENKO CORP