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Constant temperature gas/liquid mixture generating system for use in wafer drying process

a technology of gas/liquid mixture and generating system, which is applied in the direction of machines/engines, lighting and heating apparatus, heating types, etc., can solve the problems of relatively high cost and risk of fir

Inactive Publication Date: 2009-12-24
SCIENTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention proposes a system for generating a constant temperature gas / liquid mixture for use in a wafer drying process. This system includes an interior tank, a gas supplying device, an exhausting device, an exterior tank, a second liquid supplying device, a temperature control device, and a draining device. The gas supplying device supplies gas into the interior tank, where it mixes with a liquid (IPA+N2) to form a gas / liquid mixture. The gas / liquid mixture is then heated by a water bath to a desired temperature. The system also includes a liquid level detecting device and a temperature measuring device. The constant temperature gas / liquid mixture generating system is integrated with a wafer drying device, which eliminates the need for additional safety measures and reduces costs. The technical effects of this invention include effective temperature control and a safer and stable wafer drying process.

Problems solved by technology

Since IPA is a flammable liquid, the risk of a fire hazard is a safety concern while operating the aforementioned device.
Although the aforementioned device may moderately heat the N2 / IPA mixture, the cost is relatively high because of the complex structure.

Method used

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  • Constant temperature gas/liquid mixture generating system for use in wafer drying process
  • Constant temperature gas/liquid mixture generating system for use in wafer drying process
  • Constant temperature gas/liquid mixture generating system for use in wafer drying process

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Embodiment Construction

[0023]The detailed explanation of the present invention is described as following. The described preferred embodiments are presented for purposes of illustrations and description, and they are not intended to limit the scope of the present invention.

[0024]Referring to FIG. 1 and FIG. 2, in one embodiment of the constant temperature gas / liquid mixture generating system 100 for use in wafer drying process includes a interior tank 110, a first liquid supplying device 120, a gas supplying device 130, an exhausting device 140, an exterior tank 150, a second liquid supplying device 160, a temperature control device 170 and a draining device 180.

[0025]The first liquid supplying device 120 supplies a first liquid L1 into the interior tank 110, wherein the first liquid L1 comprises liquid isopropyl alcohol (IPA).

[0026]The gas supplying device 130 supplies a gas G1 into the interior tank 110, wherein the gas G1 comprises nitrogen (N2). The first liquid L1 and the gas G1 are mixed in the inter...

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PUM

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Abstract

A constant temperature gas / liquid mixture generating system for using in wafer drying process includes: an interior tank; a first liquid supplying device for supplying liquid IPA to the interior tank; a gas supplying device for supplying nitrogen to the interior tank; an exhausting device for exhausting IPA and nitrogen mixture from said constant temperature gas / liquid mixture generating system; an exterior tank, surrounding the interior tank; a second liquid supplying device for supplying a second liquid to the exterior tank; a temperature control device for controlling the second liquid to be within a desired temperature range; and a draining device for draining the second liquid out of the exterior tank.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a system for use in wafer drying process, and more particularly to a constant temperature gas / liquid mixture generating system for safely heating and generating a gas / liquid mixture for wafer drying process.[0003]2. Description of the Prior Art[0004]In a wafer drying process, one of wafer drying techniques utilizes an inert gas, such as nitrogen (N2), mixed with an organic solvent, such as isopropyl alcohol (IPA) vapor cloud. The above mixture is heated to its boiling point and the generated vapors are used for drying the wafer. As the generated vapors contacts the wafer, the residual pure water or water vapor adhering thereto from wafer rinsing step may be displaced by the vapors and then the IPA is evaporated by the heated N2 to dry the wafer.[0005]A Kimmon device, which is being extensively used at present, utilizes the aforementioned principle that an organic solvent IPA is boiled an...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F24F11/08
CPCH01L21/67034
Inventor HSIEH, HUNG-LIANGHSU, PEN-HSIEHFENG, CHUAN-CHANGLIU, MAO-LIN
Owner SCIENTECH