Unlock instant, AI-driven research and patent intelligence for your innovation.

Thermal module

a technology of thermal modules and thermal modules, applied in the direction of cooling/ventilation/heating modifications, semiconductor/solid-state device details, electronic components inside the electronic device would generate a large amount of heat, thermal modules provide a very limited heat dissipation effect, etc., to achieve the effect of reducing room, enhancing heat dissipation efficiency, and simplifying structur

Active Publication Date: 2010-03-25
ASIA VITAL COMPONENTS SHENZHEN CO LTD
View PDF1 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This configuration results in improved heat dissipation efficiency, reduced manufacturing costs, a compact design, and easier assembly, while providing an upgraded heat dissipation effect by allowing direct cooling of the heat dissipating element.

Problems solved by technology

When an electronic device operates at a high speed, electronic components inside the electronic device would generate a large amount of heat.
However, since the heat sink or radiating fin assembly of the thermal module can only radiate heat, the thermal module provides a very limited heat-dissipating effect.
Therefore, the heat generated by the heat source and absorbed by the seat 17 could not be directly dissipated, and the conventional water-cooling thermal module has poor heat dissipating efficiency and limited heat dissipating effect.
In brief, the conventional water-cooling thermal module has the following disadvantages: (1) having complicated structure; (2) providing poor heat-dissipating effect; (3) failing to directly dissipate the heat generated by the heat source; and (4) having low heat dissipating efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal module
  • Thermal module
  • Thermal module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016]Please refer to FIGS. 2 and 3 that are exploded and assembled perspective views, respectively, of a thermal module according to a preferred embodiment of the present invention. As shown, the thermal module of the present invention is generally denoted by a reference numeral A, and includes at least one heat dissipating element 24, at least one cooling chip 23, and a heat radiating unit 2.

[0017]The heat dissipating element 24 has a heat-radiating face 241 formed on one side thereof, and internally defines a heat-dissipation space 242, as can be seen from FIG. 4. And, the heat-dissipation space 242 formed inside the heat dissipating element 24 is in contact with the heat-radiating face 241.

[0018]The cooling chip 23 has a hot end 231 and a cold end 233. The cold end 233 is in contact with the heat-radiating face 241 of the heat dissipating element 24, and the hot end 231 is in contact with the heat radiating unit 2. Accordingly, the cooling chip 23 is in direct contact with the h...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A thermal module includes at least one heat dissipating element, at least one cooling chip, and a heat radiating unit. The cooling chip has a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit. With the cooling chip in direct contact with the heat radiating unit and the heat dissipating element, the heat dissipating element can be directly cooled by the cooling chip, and the thermal module can have a simplified structure to occupy a reduced room while providing enhanced heat dissipating efficiency and accordingly upgraded heat-dissipating effect.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a thermal module, and more particularly to a thermal module having a cooling chip in direct contact with a heat-radiating element and a heat dissipating element to enable upgraded heat-dissipating efficiency.BACKGROUND OF THE INVENTION[0002]When an electronic device operates at a high speed, electronic components inside the electronic device would generate a large amount of heat. In general, a thermal module consisting of a heat sink or a radiating fin assembly and one or more heat pipes is mounted to the heat-generating electronic components to obtain enhanced heat-dissipating efficiency and upgraded heat-dissipating effect. However, since the heat sink or radiating fin assembly of the thermal module can only radiate heat, the thermal module provides a very limited heat-dissipating effect. For the purpose of obtaining an improved heat dissipating effect, a cooling chip has been used with the thermal module.[0003]FIG. 1 sh...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/20
CPCH01L23/427H01L23/467H01L23/473H01L2924/0002H01L2924/00
Inventor TSAI, CHING HSIEN
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD