Non-shrinking ceramic substrate and method of manufacturing the same

Abstract

A method of manufacturing a non-shrinking ceramic substrate according to an aspect of the invention may include: preparing a ceramic laminate having a via electrode therein; firing the ceramic laminate so that a void is formed at the interface between the via electrode and the ceramic laminate; and performing plating to fill the void with a conductive material.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the priority of Korean Patent Application No. 2008-0101934 filed on Oct. 17, 2008, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a non-shrinking ceramic substrate and a method of manufacturing the non-shrinking ceramic substrate, and more particularly, to a non-shrinking ceramic substrate and a method of manufacturing the non-shrinking ceramic substrate that can prevent defects caused by voids formed in a ceramic laminate.[0004]2. Description of the Related Art[0005]Recently, with the continuing trend towards miniaturization in electronic components, small modules and substrates have been developed as the electronic components are formed into micropatterns and thin films with high precision.[0006]However, when printed circuit boards (PCBs) being widely used are u...

AI Technical Summary

Benefits of technology

[0016]An aspect of the present invention provides a non-shrinking ceramic substrate and a method of manufacturing the non-shrinking ceramic substrate that can prevent a poor electric connection caused by voids formed between internal electrodes and external electrodes when firing a ceramic laminate.

Problems solved by technology

However, when printed circuit boards (PCBs) being widely used are used in electronic components, defects, such as a reduction in size, signal loss in the high-frequency domain, and a deterioration in reliability at high temperatures and humidity, occur.

However, since the ceramic substrate does not shrink evenly in all directions, the shrinkage method causes dimensional changes in a planar direction of the ceramic substrate.

This causes defects, such as a decrease in accuracy of the pattern position and pattern disconnection.

However, since via electrodes, external electrodes, internal electrodes, and ceramic green sheets constituting a ceramic laminate are formed of different materials from each other, even when ceramic substrates are manufactured using this non-shrinking method, voids are formed at the interfaces therebetween due to differences in shrinkage characteristics and differences in thermal expansion coefficients in the firing process.

Also, an expensive ceramic substrate having hundreds of thousands of via electrodes formed therein must be discarded due to voids, inflicting heavy economic losses.

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