Thermally Conductive Composition

Active Publication Date: 2010-08-19
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]It has now been discovered that physical treatment of the fillers with a surface area modifying agent by coating the outer layer and filling the internal pores of the fillers improves the thermal conductivity of compositions containing these treated fillers compared to those compositions that contain fillers that are not so treated with the surface area modifying agent. The compositions prepared with physically treated fillers

Problems solved by technology

Electronic devices, such as those containing semiconductors, typically generate a significant amount of heat during operation.
However, increasing filler loading can

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example

Example 1

Physical Treatment of Filler with Surface Area Modifying Agent

[0046]Two different methods of physically treating fillers with a surface area modifying agent have been described.

Example

Example 1A

Solution Method

[0047]Nine grams of Pluronic F38 (EO-PO block copolymers with —OH terminations, Mw=4700 g / mol, available from BASF) was dissolved into 200 mL of water. Into the Pluronic F38-water solution, 91 g of boron nitride fillers (PTX60, available from Momentive Performance Inc., OH) were dispersed. The water was then evaporated with constant stirring and vacuum overnight. The resultant dry powder weighed 100 g.

Example

Example 1B

Fluidization Method

[0048]Nine grams of Pluronic F38 (EO-PO block copolymers with —OH terminations, Mw=4700 g / mol, available from BASF) was dissolved into 45 mL of water. The Pluronic F38-water solution and 91 g of boron nitride fillers (PTX60) were placed in a fluid bed coater (Model MFL.01 by Vector Corporation, IA) to physically treat the fillers. The resultant dry powder weighed 100 g.

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Abstract

A composition for use as a thermally conductive composition in a heat-generating electronic device is provided. The composition comprises physically treated fillers modified with a surface area modifying agent and one or more resins.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of International Application No. PCT / US2007 / 020018 filed Sep. 14, 2007, the contents of which is incorporated herein by reference.FIELD OF THE INVENTION[0002]This invention relates to a thermally conductive composition that is utilized to transfer heat from a heat-generating electronic device to a cold sink, which absorbs and dissipates the transferred heat.BACKGROUND OF THE INVENTION[0003]Electronic devices, such as those containing semiconductors, typically generate a significant amount of heat during operation. To cool the semiconductors, a thermally conductive composition is used to provide an intimate contact between the semiconductor and a cold sink to facilitate the heat transfer out of the semiconductor and to the cold sink. Thermally conductive compositions are used to improve the heat flux between hot devices / substrates and cold sinks / spreaders. Thermally conductive compositions may consist of ...

Claims

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Application Information

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IPC IPC(8): H05K7/20C04B14/00C09K5/00B05D5/12
CPCC04B20/1022C04B20/12C04B26/02C04B2111/94C09K5/14H05K7/20481C04B14/022C04B14/024C04B14/026C04B14/06C04B14/30C04B14/303C04B14/304C04B14/308C04B14/326C04B14/327C04B14/34C04B20/002C04B20/008C04B16/04C04B20/1062C04B14/22
Inventor ZHANG, YIMINXIAO, ALLISON Y.
Owner HENKEL KGAA
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