Method and system for wireless communication utilizing on-package leaky wave antennas
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a leaky wave antenna and wireless communication technology, applied in the field of wireless communication, can solve the problems of power inefficiency of transmitters and/or receivers in comparison to other blocks of portable communication devices
Inactive Publication Date: 2010-12-09
AVAGO TECH WIRELESS IP SINGAPORE PTE
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[0011]A system and/or method for wireless communication utilizing on-package leaky wave antennas as shown...
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Additionally, transmit and/or receive circuitry within such mobile wireless devices often account for a significant portion of the power consumed within these devices.
Mor...
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[0023]Certain aspects of the invention may be found in a method and system for wireless communication utilizing on-package leaky wave antennas. Exemplary aspects of the invention may comprise communicating wireless signals via an RF digital bus between integrated circuit packages in a wireless device utilizing leaky wave antennas integrated in metal layers in the plurality of integrated circuit packages. A resonant frequency of the leaky wave antennas may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. A plurality of the leaky wave antennas may be configured to enable beam-forming. The leaky wave antennas may comprise microstrip waveguides wherein a cavity height of the leaky wave antennas is dependent on a spacing between conductive lines in the microstrip waveguides. The leaky wave antennas may comprise coplanar waveguides, wherein a cavity height of the leaky wave antennas is dependent on a spacing between conductive lines in the coplanar waveguides. T...
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Abstract
Methods and systems for wireless communication utilizing on-package leaky wave antennas (LWAs) are disclosed and may include communicating wireless signals via an RF digital bus between integrated circuit packages in a wireless device utilizing LWAs integrated in metal layers in the plurality of packages. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. A plurality of the LWAs may be configured to enable beam-forming. The LWAs may include microstrip or coplanar waveguides wherein a cavity height of the LWAs is dependent on spacing between conductive lines in the waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle from a surface of the packages. The packages may be affixed to one or more printed circuit boards. An integrated circuit may be flip-chip-bonded to one or more of the packages.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS / INCORPORATION BY REFERENCE[0001]This application makes reference to, claims the benefit from, and claims priority to U.S. Provisional Application Ser. No. 61 / 246,618 filed on Sep. 29, 2009, and U.S. Provisional Application Ser. No. 61 / 185,245 filed on Jun. 9, 2009.[0002]This application also makes reference to:U.S. patent application Ser. No. 12 / 650,212 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,295 filed on Dec. 30, 2009;[0003]U.S. patent application Ser. No. 12 / 650,277 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,192 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,224 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,176 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,246 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,292 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / 650,324 filed on Dec. 30, 2009;U.S. patent application Ser. No. 12 / ...
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