Method of manufacturing semiconductor package

Abstract

Provided is a semiconductor package and method of manufacturing same. The method includes: forming a plurality of semiconductor chips which have the same pattern direction on a semiconductor substrate, each of which includes a memory cell region, a peripheral region and a pad region, and in each of which the pad region is disposed in an edge region; separating the semiconductor chips, which are formed on the semiconductor substrate, from one another; and disposing semiconductor chips, which are selected from the separated semiconductor chips, on a package substrate by changing the pattern directions of the selected semiconductor chips and arranging pad regions of the selected semiconductor chips in a center region of the package substrate.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application is a divisional application of U.S. patent application Ser. No. 12 / 367,596, filed Feb. 9, 2009, which claims the benefit of Korean Patent[0002]Application Number 10-2008-0014048, filed Feb. 15, 2008, in the Korean Intellectual Property Office, the contents of which applications are hereby incorporated herein in their entirety by reference.BACKGROUND OF THE INVENTION[0003]1. Field of the Invention[0004]The present invention relates to a method of manufacturing a semiconductor package and, more particularly, to a method of manufacturing a semiconductor package by flexibly changing the position of pads.[0005]2. Description of the Related Art[0006]Generally, a conventional semiconductor device (that is, a semiconductor package) is manufactured through a fabrication process and an assembly process. In the fabrication process, a predetermined circuit pattern is repeated on a semiconductor substrate to form a plurality of cells h...

AI Technical Summary

Benefits of technology

The present invention provides a semiconductor package and method of manufacturing it that allows for more semiconductor chips to be included in a single package. This is achieved by increasing the number of semiconductor chips that can be formed on a semiconductor substrate and then separated from one another. The semiconductor chips are then placed on a package substrate, with some of them having their pads arranged in a center region of the package substrate. The method of manufacturing the semiconductor package involves forming semiconductor chips with a pattern direction, separating them from one another, and disposing selected semiconductor chips on the package substrate. The technical effect of this invention is to enable a more flexible and efficient way of manufacturing semiconductor packages.

Problems solved by technology

However, if semiconductor devices having discrete functions are integrated onto a single semiconductor chip and if the semiconductor chip is included in a single package, when any one of the semiconductor devices of the semiconductor chip is defective, the other semiconductor devices cannot be used.

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