Flow rate measuring apparatus
a technology of flow rate and measuring apparatus, which is applied in the direction of liquid/fluent solid measurement, volume metering, instruments, etc., can solve the problems of likely disconnection of wires, etc., and achieve the effect of reducing the occurrence of disconnection of wires, and suppressing deformation of the base main body due to pipe vibration
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embodiment 1
[0039]FIG. 1 is a longitudinal sectional view of a flow rate measuring apparatus 1 according to Embodiment 1 of the present invention as viewed from an upstream side, FIG. 2 is a partially cutaway front view of the flow rate measuring apparatus 1 illustrated in FIG. 1, and FIG. 3 is an enlarged view of a principal part of the flow rate measuring apparatus 1 illustrated in FIG. 1.
[0040]An apparatus insertion hole 51 is provided to an intake pipe 50 of an internal combustion engine. The flow rate measuring apparatus 1 is inserted into the apparatus insertion hole 51 so as to be installed inside the intake pipe 50 having a cylindrical shape.
[0041]The flow rate measuring apparatus 1 includes a base 11, a plate 10, a flow rate detection element 2, a circuit board 5, and a cover 6. The plate 10 is connected to the base 11 on a surface along a flow direction of air corresponding to a fluid to be measured. The flow rate detection element 2 is provided on the plate 10 in an exposed manner an...
embodiment 2
[0074]FIG. 8 is an enlarged sectional view of a principal part of the flow rate measuring apparatus 1 according to Embodiment 2 of the present invention.
[0075]In Embodiment 2, the cover 6 is bonded to the base main body 32 by the thermosetting silicone adhesive, whereas the cover 6 is bonded to the inner wall surface 17a of the flange 17 by an epoxy adhesive having higher stiffness than that of the silicone adhesive after being cured.
[0076]The remaining configuration is the same as that of Embodiment 1.
[0077]In the flow rate measuring apparatus 1 having the above-mentioned configuration, the flange 17 and the cover 6 are connected by a bonding portion 24 corresponding to the deformation suppression means, which is formed of the cured epoxy adhesive having higher stiffness than that of the bonding portion 16 of Embodiment 1. Therefore, the base 11 and the cover 6 are more firmly connected to each other.
[0078]Thus, the amount of displacement of the base main body 32, the plate 10, and...
embodiment 3
[0086]FIG. 9 is an enlarged sectional view of a principal part of the flow rate measuring apparatus 1 according to Embodiment 3 of the present invention, and FIG. 10 is a partially cutaway front view of the flow rate measuring apparatus 1 illustrated in FIG. 9.
[0087]In Embodiment 3, a groove 27, which is to be filled with the epoxy adhesive, is formed in the cover 6 on the side closer to the flange 17 so as to extend in parallel to the inner wall surface 17a of the flange 17. A bonding rib 28, which is loosely inserted into the groove 27, is formed on the base main body 32.
[0088]A groove 25, which is to be filled with the silicone adhesive, is formed in the cover 6 on the side closer to the circuit board 5. The groove 25 is formed over an entire circumference along the enclosure portion 21 of the cover 6. A bonding rib 26, which is loosely inserted into the groove 25, is formed on a circumferential edge portion of the base main body 32, which surrounds the circuit board 5.
[0089]Furt...
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