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Heat-dissipating fin and heat-dissipating fin assembly

a heat-dissipating fin and unitary structure technology, which is applied in lighting and heating apparatus, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of heat accumulation, poor thermal conduction among heat-dissipating fins, and the following defects of conventional heat sinks, so as to improve the contact area, enhance the transverse thermal conduction, and uniform temperature distribution

Inactive Publication Date: 2013-03-28
WISTRON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a heat-dissipating fin and a heat-dissipating fin assembly that solves the problem of thermal conduction among the fins. The fins are interconnected in a way that increases the contact area and enhances the heat-dissipating effect. This results in a relatively uniform temperature distribution on the fins and improves the overall heat-dissipating effect of the assembly.

Problems solved by technology

However, the conventional heat sink has following defects.
With the bent structures, only point contact or linear contact may be generated between each adjacent pair of heat-dissipating fins assembled together through interconnected engaging portions, which results in poor thermal conduction among the heat-dissipating fins along a transverse direction (that is, a direction in which the heat-dissipating fins are arranged), thereby resulting in heat accumulation.

Method used

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  • Heat-dissipating fin and heat-dissipating fin assembly
  • Heat-dissipating fin and heat-dissipating fin assembly
  • Heat-dissipating fin and heat-dissipating fin assembly

Examples

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Embodiment Construction

[0016]Referring to FIGS. 1 to 3, a heat-dissipating fin 1 in an embodiment of this disclosure is integrally formed from, for example, an aluminum plate or other materials of good thermal conductivity by stamping. The heat-dissipating fin 1 includes a first longitudinal section 11, a second longitudinal section 12, a first contacting section 13, a second contacting section 14, and a third contacting section 15. When a plurality of the heat-dissipating fins 1 are interconnected, the first contacting sections 13 of the heat-dissipating fins 1 are contacted with each other, the second contacting sections 14 of the heat-dissipating fins 1 are contacted with each other, and the third contacting sections 15 of the heat-dissipating fins 1 are contacted with each other, so as to enhance the thermal conduction efficiency among the heat-dissipating fins 1 to thus improve the heat-dissipating effect of the heat-dissipating fins 1, which will be described below in detail.

[0017]Each of the first ...

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Abstract

A heat-dissipating fin comprises a first longitudinal section, a second longitudinal section, a first contacting section extending transversely from the first longitudinal section, a second contacting section extending transversely from the second longitudinal section, and a third contacting section connected between the first longitudinal section and the second longitudinal section and extending transversely. When a plurality of heat-dissipating fins are assembled, contact among the first contacting sections, among the second contacting sections, and among the third contacting sections of the heat-dissipating fins are established.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims priority of Taiwanese Patent Application No. 100134978, filed on Sep. 28, 2011, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE DISCLOSURE[0002]1. Field of the Disclosure[0003]The disclosure relates to a heat-dissipating fin, more particularly to a unitary structure of a heat-dissipating fin.[0004]2. Description of the Related Art[0005]A conventional heat sink comprises a plurality of elongate heat-dissipating fins assembled together. Each of the heat-dissipating fins is made of an aluminum plate or other materials of good thermal conductivity, and has a bent structure for being engaged with an adjacent one of the heat-dissipating fins. However, the conventional heat sink has following defects. With the bent structures, only point contact or linear contact may be generated between each adjacent pair of heat-dissipating fins assembled together through interconnected engaging portions, wh...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCH01L23/3672F28F3/02H01L2924/0002H01L2924/00
Inventor WANG, WEI-HSINGCHIANG, MENG-TINGTSAI, YAO-LUNG
Owner WISTRON CORP