Heat-dissipating fin and heat-dissipating fin assembly
a heat-dissipating fin and unitary structure technology, which is applied in lighting and heating apparatus, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of heat accumulation, poor thermal conduction among heat-dissipating fins, and the following defects of conventional heat sinks, so as to improve the contact area, enhance the transverse thermal conduction, and uniform temperature distribution
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[0016]Referring to FIGS. 1 to 3, a heat-dissipating fin 1 in an embodiment of this disclosure is integrally formed from, for example, an aluminum plate or other materials of good thermal conductivity by stamping. The heat-dissipating fin 1 includes a first longitudinal section 11, a second longitudinal section 12, a first contacting section 13, a second contacting section 14, and a third contacting section 15. When a plurality of the heat-dissipating fins 1 are interconnected, the first contacting sections 13 of the heat-dissipating fins 1 are contacted with each other, the second contacting sections 14 of the heat-dissipating fins 1 are contacted with each other, and the third contacting sections 15 of the heat-dissipating fins 1 are contacted with each other, so as to enhance the thermal conduction efficiency among the heat-dissipating fins 1 to thus improve the heat-dissipating effect of the heat-dissipating fins 1, which will be described below in detail.
[0017]Each of the first ...
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