Imaging device
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first embodiment
[0044]FIG. 1 is a perspective view of an outer appearance of a digital camera (which is an exemplary imaging device) according to a first embodiment of the present disclosure. The digital camera according to the first embodiment includes a camera main body 1 and an exchangeable lens unit 2 which is mountable to the camera main body 1. FIG. 2 is a perspective view of an outer appearance of the camera main body 1 from which the exchangeable lens unit 2 is removed. FIG. 3 is a schematic cross-sectional view of an internal structure of the digital camera. FIG. 4 is a functional block diagram illustrating the digital camera.
[0045]Firstly, referring to FIG. 1 to FIG. 4, a fundamental structure of the digital camera according to the first embodiment will be described. In the description herein, for convenience of description, an object side of the digital camera is referred to as the front, and an imaging plane side of the digital camera is referred to as the rear or the back.
[0046]As show...
second embodiment
[0102]FIG. 12 is a cross-sectional view of an internal structure of an imaging device 200, as viewed from thereabove, according to a second embodiment of the present disclosure. For the present embodiment, control of a GND potential in the imaging sensor flexible cable and control of a GND potential in the metal plate will be mainly described, and detailed description of matters other than the controls is omitted. A fundamental structure of the imaging device 200 is the same as that of the digital camera described with reference to FIG. 1 to FIG. 4.
[0103]As shown in FIG. 12, the imaging device 200 includes the imaging sensor 110, the main circuit substrate 120, the imaging sensor flexible cable 130, the mount 140, the metal plate 150, the connection sections 160, electrically-conductive elastic sections 170, and the electrically-conductive section 190. The imaging sensor flexible cable 130 has GND exposure portions 132. The metal plate 150 has metal plate recesses 152. Further, the ...
third embodiment
[0116]FIG. 16 is a cross-sectional view of an internal structure of an imaging device 300, as viewed from thereabove, according to a third embodiment of the present disclosure. For the present embodiment, difference from the first embodiment will be mainly described. A fundamental structure of the imaging device 300 is the same as that of the digital camera described with reference to FIG. 1 to FIG. 4.
[0117]As shown in FIG. 16, the imaging device 300 includes the imaging sensor 110, the main circuit substrate 120, the imaging sensor flexible cable 130, the mount 140, the metal plate 150, the connection sections 160, and the electrically-conductive section 190. The imaging sensor flexible cable 130 has the GND exposure portions 131. The metal plate 150 has the metal plate projections 151. The main circuit substrate 120 has the GND removal portion 180 and the AD conversion LSI 185 (an integrated circuit for AD conversion) on the front surface on the metal plate 150 side. In FIG. 16, t...
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