Heat sink

a heat sink and heat dissipation technology, applied in the direction of cooling/ventilation/heating modifications, semiconductor/solid-state device details, solid-state devices, etc., can solve the problems of reducing the temperature of the heating part where cooling water is injected, reducing the and requiring relatively high pumping power, so as to reduce the loss of flow pressure of cooling water and increase the heat dissipation effect

Inactive Publication Date: 2013-05-09
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0011]The present invention has been made in an effort to provide a heat sink capable of incr

Problems solved by technology

Recently, in order to enhance efficiency of vehicles, PCUs tend to be lightweight, compact, and highly integrated, and thus, heat dissipation of highly integrated power devices is an important issue.
However, the heat sink has a problem in that temperature of a heating part where cooling water is

Method used

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Embodiment Construction

[0032]Various features and advantages of the present invention will be more obvious from the following description with reference to the accompanying drawings.

[0033]The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe most appropriately the best method he or she knows for carrying out the invention.

[0034]The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. In the specification, in adding reference numerals to components throughout the drawings, it is to be noted that like reference numerals designate like component...

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Abstract

Disclosed herein is a heat sink including: a first region connected to a cooling water introduction part and having a plurality of first pins arranged therein; and a second region connected to a cooling water discharge part and having a plurality of second pins arranged therein.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2011-0114602, filed on Nov. 4, 2011, entitled “Heat Sink”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a heat sink.[0004]2. Description of the Related Art[0005]A power control unit (PCU), including an inverter for converting a DC current supplied from a battery into an AC current for driving a motor and a control device for effectively converting it, is essential in an electric vehicle.[0006]Recently, in order to enhance efficiency of vehicles, PCUs tend to be lightweight, compact, and highly integrated, and thus, heat dissipation of highly integrated power devices is an important issue.[0007]Meanwhile, Korean Patent No. 0598516 discloses a heat sink according to the prior art.[0008]As disclosed in the Patent Document, the prior art heat sink is...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCH01L23/473H05K7/20254H01L2924/0002H01L2924/00H01L23/34H05K7/20
Inventor KWAK, YOUNG HOONOH, KYU HWAN
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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