Heat-dissipating device

Abstract

A heat-dissipating device includes a base and a heat pipe. One side of the base is provided with an accommodating trough for accommodating the heat pipe. The heat pipe has a first heat-absorbing section, a second heat-absorbing section, a third heat-absorbing section provided between the first heat-absorbing section and the second heat-absorbing section, a first heat transfer section, and a second heat transfer section. The first, second and third heat-absorbing sections conduct the heat to the first and second heat transfer sections, and thus the heat-dissipating effect of the present invention is improved greatly.

Description

[0001]This application claims the priority benefit of Taiwan patent application number 100149716 filed on Dec. 30, 2011.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a heat-dissipating device, and in particular to a heat-dissipating which has an improved heat transfer efficiency and overcomes the problem of prior art that the heat transfer efficiency at inactive ends of the conventional heat pipe is poor.[0004]2. Description of Prior Art[0005]As a heat sink for dissipating the heat generated by an electronic element (such as CPU or other processing unit), a base is used as a heat-conducting part brought into thermal contact with the electronic element. When the base is brought into thermal contact with the electronic element, however, only a central region of the bottom surface of the base is brought into thermal contact with the electronic element, so that the heat transfer capacity of the base is limited. As a result, the heat gen...

AI Technical Summary

Benefits of technology

[0014]In order to solve the above problems, an objective of the present invention is to provide a heat-dissipating device which has improved heat transfer efficiency (or heat-conducting efficiency) and overcomes the problem that the heat transfer effect at inactive ends of the heat pipe is poor.

[0015]In order to achieve the above objective, the present invention is to provide a heat-dissipating device including a base and a heat pipe. The base has an accommodating trough. The accommodating trough is provided on one side of the base. The heat pipe is received in the accommodating trough. The heat pipe has a first heat-absorbing section, a second heat-absorbing section, a third heat-absorbing section, a first heat transfer section and a second heat transfer section. The

Problems solved by technology

When the base is brought into thermal contact with the electronic element, however, only a central region of the bottom surface of the base is brought into thermal contact with the electronic element, so that the heat transfer capacity of the base is limited.

As a result, the heat generated by the electronic element cannot be transferred from the central region of the base to the whole base rapidly, which makes t

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