Fan module

Abstract

A fan module includes a heat transfer unit, a heat radiation unit, and at least one cross-flow fan. The heat radiation unit has an air-in side and an air-out side. The cross-flow fan is located against the heat radiation unit, and includes a frame and a centrifugal fan blade assembly. The frame has an air outlet, a plurality of air inlets, and a plurality of frame sections. The frame sections respectively have a receiving recess therein, and the receiving recesses are communicable with one another to together define a receiving space for receiving the centrifugal fan blade assembly therein. With the above arrangements, the cross-flow fan can create increased air flow volume, the space occupied by the fan module can be reduced, and upgraded heat dissipation performance can be achieved.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a fan module, and more particularly to a fan module that allows at least one cross-flow fan to create largely increased air flow volume, has reduced overall volume, provides upgraded heat dissipation performance, and effectively overcomes the problems of vibration and noise caused by excessively long blades as found in the conventional fan module.BACKGROUND OF THE INVENTION[0002]Due to the constant progress in the electronic technological fields, the density of transistors on various kinds of chips, such as the central processing unit and other executing elements, also increases to enable faster data processing speed. However, more power is consumed and more heat is produced by these chips during high-speed operation thereof. For the central processing unit to work stably, it has become an important issue as how to develop a high-efficient heat dissipation means for dissipating the produced heat.[0003]To maintain high-effi...

AI Technical Summary

Benefits of technology

The present invention provides a fan module with a cross-flow fan that has reduced volume and increased air flow volume. This fan module improves heat dissipation performance and overcomes issues of vibration and noise caused by long blades. It can be used in limited space and creates a more efficient and quieter fan compared to conventional fan modules.

Problems solved by technology

However, more power is consumed and more heat is produced by these chips during high-speed operation thereof.

For the central processing unit to work stably, it has become an important issue as how to develop a high-efficient heat dissipation means for dissipating the produced heat.

However, in the design of currently very popular notebook computers, tablet computers, smart mobile phones, smart hand-held electronic devices and the like, the limited internal space thereof is always a bottleneck to the heat dissipation means design.

However, the long radiating fins tend to increase the overall volume of the fan module, and a big fan module just fails to meet the demands for compact, slim and light weight notebook computers and the like.

Further, the miniaturized centrifugal fan usually has thin but large-area fan blades, which tend to produce more vibration and noise when the centrifugal fan operates.

In brief, the conventional fan module has the following disadvantages: (1) having a relatively big volume; (2) providing low heat dissipation ability; and (3) tending to produce vibration and noise during operation thereof.

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