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Integrated circuit packaging system with terminals and method of manufacture thereof

a terminal and integrated circuit technology, applied in the field of integrated circuit packaging systems, can solve the problems of eluded skilled in the art, unable to provide a complete solution addressing simplified manufacturing processing, small dimensions, and low cost, and achieve the effects of reducing manufacturing costs, reducing manufacturing costs, and reducing manufacturing costs

Active Publication Date: 2013-09-26
STATS CHIPPAC LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method and system for packaging integrated circuits. This system includes a leadframe with a mounting platform and an attached layer, an integrated circuit die, and a terminal with a terminal protrusion. The integrated circuit die is mounted on the attach layer, and an encapsulation is formed on top of the integrated circuit die and the attach layer, with the mounting platform exposed. The technical effect of this invention is to provide a more compact and efficient integrated circuit packaging system with improved signal stability and reliability.

Problems solved by technology

Each of the integrated circuit packages within the cell phone can contain large amounts of complex circuitry.
Attempts have failed to provide a complete solution addressing simplified manufacturing processing, smaller dimensions, lower costs due to design flexibility, increased functionality, leveragability, and increased IO connectivity capabilities.
Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.

Method used

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  • Integrated circuit packaging system with terminals and method of manufacture thereof
  • Integrated circuit packaging system with terminals and method of manufacture thereof
  • Integrated circuit packaging system with terminals and method of manufacture thereof

Examples

Experimental program
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first embodiment

[0034]Referring now to FIG. 1, therein is shown a cross-sectional view of an integrated circuit packaging system 100 taken along line 1-1 of FIG. 2 in the present invention. The integrated circuit packaging system 100 is shown having an encapsulation 102, a mounting platform 103, an integrated circuit die 108, and a terminal 114.

[0035]The encapsulation 102 covers the mounting platform 103, the integrated circuit die 108, and the terminal 114 and provides mechanical protection, environmental protection, and a hermetic seal for the integrated circuit packaging system 100. The encapsulation 102 can be made from an epoxy molding compound (EMC), film assisted molding, polymide compound, or a wire-in-film (WIF), as examples.

[0036]The integrated circuit packaging system 100 can include the mounting platform 103, which is defined as a structure for mounting components, dies, and devices. The mounting platform 103 can be made from metals including gold, silver, nickel, other conductive metal...

second embodiment

[0052]Referring now to FIG. 3, therein is shown a cross-sectional view of an integrated circuit packaging system 300 exemplified by the top view of FIG. 2 taken along line 1-1 of FIG. 2 in the present invention. The integrated circuit packaging system 300 is shown having an encapsulation 302, a mounting platform 303, an integrated circuit die 308, and a terminal 314.

[0053]The encapsulation 302 covers the mounting platform 303, the integrated circuit die 308, and the terminal 314 and provides mechanical protection, environmental protection, and a hermetic seal for the integrated circuit packaging system 300. The encapsulation 302 can be made from an epoxy molding compound (EMC), film assisted molding, polymide compound, or a wire-in-film (WIF), as examples.

[0054]The integrated circuit packaging system 300 can include the mounting platform 303, which is defined as a structure for mounting components, dies, and devices. The mounting platform 303 can be made from metals including gold, ...

third embodiment

[0070]Referring now to FIG. 4, therein is shown a cross-sectional view of an integrated circuit packaging system 400 exemplified by the top view of FIG. 2 taken along line 1-1 of FIG. 2 in the present invention. The integrated circuit packaging system 400 can stack the integrated circuit packaging system 100 of FIG. 1 in a configuration for a package-on-package system.

[0071]The integrated circuit packaging system 400 is shown having an encapsulation 402, a mounting platform 403, an integrated circuit die 408, and a terminal 414. The encapsulation 402 covers the mounting platform 103, the integrated circuit die 408, and the terminal 414 and provides mechanical protection, environmental protection, and a hermetic seal for the integrated circuit packaging system 400. The encapsulation 402 can be made from an epoxy molding compound (EMC), film assisted molding, polymide compound, or a wire-in-film (WIF), as examples.

[0072]The integrated circuit packaging system 400 can include the mount...

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Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a mounting platform; applying an attach layer on the mounting platform; mounting an integrated circuit die on the attach layer; forming an encapsulation on the integrated circuit die and the attach layer, the mounting platform exposed from the encapsulation; and forming a terminal having a terminal protrusion from the leadframe, the terminal protrusion below a horizontal plane of the mounting platform.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S)[0001]The present application contains subject matter related to a concurrently filed U.S. Patent Application by Byung Tai Do, Arnel Senosa Trasporto and Linda Pei Ee Chua entitled “INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND LEADFRAME ETCHING AND METHOD OF MANUFACTURE THEREOF”. The related application is assigned to STATS ChipPAC Ltd. and is identified by docket number 27-826. The subject matter thereof is incorporated herein by reference thereto.TECHNICAL FIELD[0002]The present invention relates generally to an integrated circuit packaging system, and more particularly to a system with terminals.BACKGROUND ART[0003]The integrated circuit package is the building block used in a high performance electronic system to provide applications for usage in products such as automotive vehicles, pocket personal computers, cell phone, intelligent portable military devices, aeronautical spacecraft payloads, and a vast line of other simila...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/28H01L21/56
CPCH01L23/28H01L23/3107H01L2924/15331H01L23/49548H01L23/49582H01L21/4832H01L25/105H01L2225/1088H01L2224/16225H01L2224/32225H01L2224/32245H01L2224/48227H01L2224/48247H01L2224/73265H01L2224/92247H01L2225/1023H01L2225/1058H01L2924/15311H01L2924/00012H01L2924/00H01L24/73
Inventor DO, BYUNG TAITRASPORTO, ARNEL SENOSACHUA, LINDA PEI EE
Owner STATS CHIPPAC LTD