Cooling assembly

Abstract

A cooling assembly includes a device chamber, a cooling chamber separated from the device chamber, a heat exchanger, a device chamber fan arrangement and a control unit. The heat exchanger includes a first portion located in the device chamber and a second portion located in the cooling chamber for transferring heat from the device chamber to the cooling chamber. The device chamber fan arrangement is configured to generate a device chamber cooling medium flow including a first partial flow interacting with the first portion of the heat exchanger. The cooling assembly also includes a first throttle arrangement for regulating the first partial flow. The control unit is configured to reduce a cooling power of the heat exchanger as a response to predetermined operating conditions by decreasing the first partial flow with the first throttle arrangement.

Description

RELATED APPLICATION[0001]This application claims priority under 35 U.S.C. §119 to European Patent Application No. 13153787.0 filed in Europe on February 4, 2013, the entire content of which is hereby incorporated by reference in its entirety.FIELD[0002]The present disclosure relates to a cooling assembly including a heat exchanger for transferring heat from a device chamber.BACKGROUND INFORMATION[0003]Humidity is harmful to many electronic components. Humidity is an issue, for example, in solar power plants and wind power plants. Challenging environments such as tropical or arctic climates increase problems caused by humidity.[0004]In a known cooling assembly, heating of a device chamber is used to prevent excessive humidity. It is also known to use water absorbing materials such as silica gel to remove humidity from a device chamber.[0005]Preventing humidity by means of heating induces extra cost. Water absorbing materials are also expensive and their useful life is limited thereby...

AI Technical Summary

Benefits of technology

[0006]An exemplary embodiment of the present disclosure provides a cooling assembly which includes a device chamber, a cooling chamber separated from the device chamber, a heat exchanger, device chamber fan means, and control means. The heat exchanger includes a first portion located in the device chamber and a second portion located in the cooling chamber for transferring heat from the device chamber to the cooling chamber. The device chamber fan means are configured to generate a device chamber cooling medium flow including a first partial flow interacting with the first portion of the heat exchanger. The exemplary cooling assembly also includes first throttle means for regulating the first partial flow. The control means are configured to reduce a cooling power of the heat exchanger as a response to predetermined operating conditions by decreasing the first partial flow with the first throttle means.

Problems solved by technology

Humidity is harmful to many electronic components.

Humidity is an issue, for example, in solar power plants and wind power plants.

Challenging environments such as tropical or arctic climates increase problems caused by humidity.

Preventing humidity by means of heating induces extra cost.

Water absorbing materials are also expensive and their useful life is limited thereby further increasing cost.

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