Detection apparatus and method of chemical mechanical polishing conditioner

Abstract

The present invention relates to a detection apparatus of chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working plane of the working platform, for carrying a chemical mechanical polishing conditioner; an image capture device forming one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner; a display device; an image recognition module, wherein the captured images are performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate location of the risk diamonds are outputted into the display device; and a mobile platform for moving the risk diamonds to specified locations. A detection method of the above mentioned detection apparatus is also disclosed.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefits of the Taiwan Patent Application Serial Number 102116516, filed on May 9, 2013, the subject matter of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a detection apparatus and a method of a chemical mechanical polishing conditioner, and more particularly to a chemical mechanical polishing conditioner which may provide a detection of risk diamond on the chemical mechanical polishing conditioner.[0004]2. Description of Related Art[0005]Chemical mechanical polishing (CMP) is a common polishing process in various industries, which can be used to grind the surfaces of various articles, including ceramics, silicon, glass, quartz, or a metal chip. In addition, with the rapid development of integrated circuits, chemical mechanical polishing becomes one of the common techniques for wafer planarization due to its ability to...

AI Technical Summary

Benefits of technology

[0010]An object of the present invention is to provide a detection apparatus and a method of a chemical mechanical polishing conditioner to detect whether the chemical mechanical polishing conditioner has risk diamonds or not, and to remove risk diamond on the chemical mechanical polishing conditioner, thereby avoiding scratches and breakages produced on the polishing pad due to the risk diamonds during a chemical mechanical polishing process.

[0011]The present invention is different from the well-known methods for detecting risk diamonds in which a polishing pad is directly performed a polishing test by the conditioner, or the total areas of the conditioner are performed a check by a person. A person wastes his energy and time on the well-known methods, and the detection results of the well-known method are still doubtful. During a manufacturing process of the general chemical mechanical polishing conditioner, the brazing powder comprising a metal alloy and the diamond particles are disposed on a surface of a substrate made of stainless steel and performed a heat brazing process, so that the diamond particles are fixed on the surface of the substrate by the brazing ally to complete a manufacture of the chemical mechanical polishing conditioner. In the general chemical mechanical polishing conditioner, the yellow diamonds including nitrogen-containing dopants are often used as the abrasive particles. After the heat brazing process, the diamonds shown yellow color in origin become black color and the surfaces of the completed chemical mechanical polishing conditioner are shown totally block color by a person's eyes, because the side of the brazing surface can absorbs incident light after hard brazing process. However, during an actual process for manufacturing the chemical mechanical polishing conditioner, a part of diamond particles include risk diamonds with twin crystal structures or internal crack structures; wherein the risk diamonds may come from the source of materials of the diamonds themselves, or the risk diamonds may come from the diamond particles in the brazing process or the conditioner in the post-processing procedure. The risk diamonds are different from general diamond particles with perfect crystal forms which can absorb the incident light to show block color through brazing alloy. Because these risk particles have twin crystal structures or internal crack structures present on the inside or the reflecting surface, the incident light will be reflected and the risk diamonds are shown yellow color, namely, themselves color of the general yellow diamonds including nitrogen-containing dopants. Therefore, the present invention will determine whether the conditioner has risk diamonds or not and position thereof by means of detecting every diamond particle on the conditioner, and then the risk diamonds are further removed from the chemical mechanical polishing conditioner, thereby avoiding scratches and breakages produced on the polishing pad due to the risk diamonds during a chemical mechanical polishing process. In the detection apparatus of the chemical mechanical polishing conditioner of the present invention, the present invent cannot only detect and determine the risk diamonds shown yellow color, but also can detect different dopants or diamonds with different colors based on polishing requirements, but the present invention is not limited thereto.

[0012]To achieve the above object, the present invention provides a detection apparatus of a chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working plane of the working platform, which is used to carry a chemical mechanical polishing conditioner; an image capture device set over the placement base of the working platform, and the image capture device and the placement base parallel to the working plane, wherein the image capture device is used to form one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner; a display device; an image recognition module electrically connected to the image capture device and the display device, wherein the captured images are performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate locations of the risk diamonds are outputted into the display device; and a mobile platform made the risk diamonds remove to a specified location which is a coordinate location outputted by the image recognition module. Therefore, when the detection apparatus of the chemical mechanical polishing conditioner is operated, the chemical mechanical polishing conditioner to be detected is disposed on the placement base, and one or a plurality of captured images are formed on the different regions of the chemical mechanical polishing conditioner by the image capture device. Then the captured images are transmitted into the image recognition module to transform optical signal into electronic signals through the image recognition module, and then the electronic signals are transformed into optical spectrums and a color matching is performed to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, further, the coordinate locations of risk diamonds are determined by a general position location system. Then the coordinate locations are transformed into the display device by the image recognition module to show the coordinate locations of risk diamonds, and the mobile platform can make risk diamonds remove to the specified location according to the coordinate locations provided from the image recognition module.

Problems solved by technology

A person wastes his energy and time on the well-known methods, and the detection results of the well-known method are still doubtful.

However, during an actual process for manufacturing the chemical mechanical polishing conditioner, a part of diamond particles include risk diamonds with twin crystal structures or internal crack structures; wherein the risk diamonds may come from the source of materials of the diamonds themselves, or the risk diamonds may come from the diamond particles in the brazing process or the conditioner in the post-processing procedure.

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