Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium

Abstract

A substrate processing apparatus processes a substrate by supplying a gas into a processing space. The apparatus includes a buffer space wherein the gas is dispersed, the buffer space disposed at an upstream side of the processing space; a transfer space where the substrate passes when transferred to the processing space; a first, a second and a third exhaust pipe connected to the transfer space, the buffer space and the processing space, respectively; a fourth exhaust pipe connected to downstream sides of the first exhaust pipe, the second exhaust pipe and the third exhaust pipe; a first vacuum pump disposed at the first exhaust pipe; a second vacuum pump disposed at the fourth exhaust pipe; a first valve disposed at the first exhaust pipe at a downstream side of the first vacuum pump; and a second and a third valve disposed at the second and the third exhaust pipe, respectively.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION[0001]This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Japanese Patent Application No. 2013-271927 filed on Dec. 27, 2013 in the Japanese Patent Office, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a substrate processing apparatus, a method of manufacturing a semiconductor device, and a non-transitory computer-readable recording medium.[0004]2. Description of the Related Art[0005]It has been known that a vacuum pump such as a turbo molecular pump (TMP) or the like is used in an exhaust system in order to perform an ultra-high vacuum process in a substrate processing apparatus of a semiconductor manufacturing apparatus or the like (see, for example, Patent Document 1 below).PRIOR ART DOCUMENTPatent Document[0006]1. Japanese Patent Application Publication No. H11-300193SUMMARY OF THE INVEN...

AI Technical Summary

Benefits of technology

The present invention provides a substrate processing apparatus that can improve the stability of the vacuum pump in the exhaust system. This helps to manufacture semiconductor devices more efficiently and reliably. The method and computer-readable recording media of the invention contribute to the overall improvement of the substrate processing apparatus.

Problems solved by technology

If the pressure on the downstream side of the vacuum pump rises due to some reasons, a gas flows back to the vacuum pump, and therefore there is a possibility that operations of the vacuum pump becomes unstable.

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