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System and method for cloud testing and remote monitoring of integrated circuit devices

a technology for integrated circuit devices and cloud testing, applied in automated test systems, testing circuits, instruments, etc., can solve problems such as unintentional human errors, and increased test costs and test tim

Inactive Publication Date: 2015-09-10
UNIGEN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a system and method for testing and monitoring integrated circuits in the cloud. The goal is to overcome the limitations of existing methods.

Problems solved by technology

Through such manual testing operation, unintentional human errors may occur.
In this case, greater test costs and longer test time are needed.
However, such automated test equipment may be relatively complicated, and have a limited throughput and a relatively costly sale price of about one million U.S. dollars.

Method used

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  • System and method for cloud testing and remote monitoring of integrated circuit devices
  • System and method for cloud testing and remote monitoring of integrated circuit devices
  • System and method for cloud testing and remote monitoring of integrated circuit devices

Examples

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Embodiment Construction

[0027]Referring to FIG. 1, the preferred embodiment of a system for cloud testing and remote monitoring of a plurality of integrated circuit (IC) devices 5 according to the present invention is shown to include a plurality of testing apparatuses 1, a master server 2 and a cloud server unit 3. Each IC device 5 has a unique device code. In this embodiment, the IC device 5 may be, but is not limited to, a memory module, such as a memory card, or a solid state disk (SSD). When the IC device 5 is a memory module or an SSD, a product serial number serves as the unique device code. In addition, referring to FIG. 2, the IC device 5 may be an IC assembly, which includes a test fixture 51, and a plurality of memory ICs 52, such as double-data-rate two synchronous dynamic random access memories (DDR2 SDRAMs), DDR3 SDRAMs or DDR4 SDRAMs, that are disposed detachably in the test fixture 51. The test fixture 51 has the unique device code, and includes a base body that has a connection interface 5...

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Abstract

In a system and method for cloud testing and remote monitoring of IC devices on a computerized test platform, the computerized test platform sends to a cloud server unit, which stores test programs corresponding respectively to different test items, a test request, which includes respective device codes of the IC devices and one(s) of the test items, via a communication network. The cloud server unit sends to the computerized test platform a test response, which includes one(s) of the test programs corresponding to the one(s) of the test items. The computerized test platform products test data corresponding to the device codes of the IC devices in response to execution of the one(s) of the test programs.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The invention relates to testing an integrated circuit device, and more particularly to a system and method for cloud testing and remote monitoring of integrated circuit devices on the same testing apparatus.[0003]2. Description of the Related Art[0004]Integrated circuit (IC) devices are typically subject to rigorous testing before they are sold or put to their intended use. In particular, each IC device is tested to determine whether or not certain specifications for that type of device, as determined and set by the manufacturer, are met.[0005]For example, a memory device (or a memory module) is one of the key components for stability and reliability in operation of an operating system of a personal computer. Therefore, before the memory device is sold, it is required for the manufacturer thereof to have professional testers carry out compatibility and reliability tests of the memory device in a computer system. Curren...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G01R31/28
CPCG01R31/2834G01R31/2851G06F11/273G06F11/22G06F11/263G06F11/2294G06F11/2635G01R31/31908
Inventor LIN, DAVID S.TSENG, YU-CHIEHYEH, PEI-LUNGLIN, YI-CHIEHCHUANG, CHE-CHEN
Owner UNIGEN CORP
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