Heat dissipating device and heat dissipating fin
a heat dissipating device and heat dissipating fin technology, which is applied in the direction of indirect heat exchangers, lighting and heating apparatus, tubular elements, etc., can solve the problems of significant performance issues of heat dissipating devices, electrical components may get damaged due to accumulated heat, and current in circuits will generate unnecessary heat, so as to improve yield rate and manufacturing efficiency
Inactive Publication Date: 2016-10-27
COOLER MASTER CO LTD
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- Abstract
- Description
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- Application Information
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Benefits of technology
The invention improves the connection between a heat pipe and a heat dissipating fin by forming two arch-shaped portions at the opposite sides of the through hole of the fin. This results in a tight-fitting connection that increases the yield rate and efficiency of manufacturing the heat dissipating device.
Problems solved by technology
When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance.
If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat.
Therefore, the performance of heat dissipating device is a significant issue for the electronic product.
However, when the heat pipe is inserted into the through hole by the first method, the heat pipe and the heat dissipating fin may pull and drag each other, such that a surface of the heat pipe may be scratched, the heat dissipating fin may deform or the through hole may crack.
However, the process of the second method is complicated and additional thermal conductive adhesive or solder paste may be remained on the heat dissipating fin, such that the appearance is not good and the thermal impedance increases accordingly.
Furthermore, the manufacturing time is long, so the manufacturing efficiency is low.
Method used
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[0015]Referring to FIGS. 1 to 4, FIG. 1 is a perspective view illustrating a heat dissipating device 1 according to an embodiment of the invention, FIG. 2 is a perspective view illustrating the heat dissipating device 1 shown in FIG. 1 from another viewing angle, FIG. 3 is a perspective view illustrating the heat dissipating fin 10 shown in FIG. 1, and FIG. 4 is a perspective view illustrating the heat dissipating fin 10 shown in FIG. 3 from another viewing angle.
[0016]As shown in FIGS. 1 and 2, the heat dissipating device 1 of the invention comprises a plurality of heat dissipating fins 10, a plurality of heat pipes 12 and a base 14, wherein the number of the heat dissipating fins 10 and the number of the heat pipes 12 can be determined according to practical applications and are not limited to the embodiment shown in FIGS. 1 and 2. The heat dissipating fin 10 comprises a fin body 100, a plurality of through holes 102, a plurality of first arc-shaped portions 104 and a plurality of...
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A heat dissipating device includes a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole, a first arc-shaped portion and a second arc-shaped portion. The through hole is formed on the fin body and has a central line. The first arc-shaped portion extends from the through hole in a first direction and the second arc-shaped portion extends from the through hole in a second direction, wherein the first direction is opposite to the second direction. The first arc-shaped portion and the second arc-shaped portion are located at opposite sides of the central line. The heat pipe is disposed in the through hole.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The invention relates to a heat dissipating device and a heat dissipating fin and, more particularly, to a heat dissipating fin having two arc-shaped portions located at opposite sides of a through hole and a heat dissipating device equipped with the heat dissipating fin.[0003]2. Description of the Prior Art[0004]Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.[0005]So far the heat dissipating device used in the electronic product usually consists of a heat pipe, a heat dissipating fin and a heat d...
Claims
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Patent Timeline
Login to View More IPC IPC(8): F28D15/02
CPCF28D15/02F28D15/0275F28F1/32
Inventor SHIEH, TUNG-YANGCHANG, SHIH-YI
Owner COOLER MASTER CO LTD