Mobile terminal
a mobile terminal and terminal technology, applied in the direction of lighting and heating apparatus, instruments, semiconductor/solid-state device details, etc., can solve the problems of explosive increase in the performance and integration of application processor (ap) chips, serious problems in the heating of ap chips, and fast discharge of batteries, etc., to achieve excellent thermal conductivity, improve the effect of thickness and rigidity, and simplify the structur
Inactive Publication Date: 2016-11-24
LG ELECTRONICS INC
View PDF18 Cites 26 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
This patent describes a thin and rigid vapor chamber that can replace the heat dissipation sheet and frame of a mobile terminal, simplifying the structure. It is designed to lower the heating temperature of products with thin structures, such as digital TVs, advertisement displays, notebook computers, and tablets, and can also strengthen the rigidity of a heat dissipation element by applying a clad metal. The ultra-slim vapor chamber acts as a heat pipe and frame, and solves the problem of heat accumulation in products that overheat due to high-density integration.
Problems solved by technology
Recently, as mobile terminals including smartphones implement various functions required in all aspects of daily lives, such as Internet, games, mobile payment, music, video, and the like, beyond the simple voice call function, performance and integration of application processor (AP) chips have explosively increased, and thus, heating of AP chips is a serious problem.
Heating is not limited to AP chips but significantly increases power consumption of chips, resulting in fast discharge of batteries, and for users, a surface of a mobile terminal is hot to cause user inconvenience, and in a worst case scenario, the risk of burns is increasing.
However, the graphite sheet itself has excellent heat dissipation characteristics, but due to the very low heat dissipation characteristics of the frame formed of a metal, the heat characteristics of the graphite and the frame are averaged, resulting in that a reduction in the heating of the AP chip is not greatly improved overall.
Also, although an existing heat pipe has excellent thermal conductivity, there is a limitation in the strength and thickness, and thus, the use of existing heat pipes is limited.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0033]Hereinafter, the embodiments of the present invention will be described with reference to the accompanying drawings, in which like numbers refer to like elements throughout although the embodiments are different, and a description of the like elements a first embodiment will be used for those of the different embodiment. In the following description, usage of suffixes such as ‘module’, ‘part’ or ‘unit’ used for referring to elements is given merely to facilitate explanation of the present invention, without having any significant meaning by itself. In describing the present invention, if a detailed explanation for a related known function or construction is considered to unnecessarily divert the gist of the present invention, such explanation has been omitted but would be understood by those skilled in the art. The accompanying drawings of the present invention aim to facilitate understanding of the present invention and should not be construed as limited to the accompanying d...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A mobile terminal includes: an upper plate; and a lower plate having a size corresponding to that of the upper plate and having at least a portion spaced apart from the upper plate to form a passage to allow fluid to flow therein, wherein the upper plate and the lower plate form a vapor chamber, at least one of the upper plate and the lower plate is formed by bonding dissimilar-metals, and the passage includes an absorption layer in which a working fluid moves and a vapor channel formed on the absorption layer and allowing vapor evaporated from the absorption layer to move therein, and a fluidic channel in which the working fluid moves is formed within the absorption layer.
Description
TECHNICAL FIELD[0001]The present disclosure relates to a mobile terminal and, more particularly, to a mobile terminal in which an existing magnesium (Mg) frame is substituted with a vapor chamber that outwardly dissipates heat from a heating element within the mobile terminal.BACKGROUND ART[0002]In general, a heat pipe serves to outwardly transmit heat from a heating element, among large components such as a PC server, a combined heat and power generator, and the like, to prevent overheating.[0003]FIG. 1 is a view illustrating an operation principle of a general heat pipe 10. Referring to FIG. 1, the heat pipe 10 includes an exterior 11 formed of a material having excellent heat transmission performance and an absorption layer 12 formed on inner walls of the exterior 11. A fluidic channel through which a working fluid 25 flows is formed within the absorption layer 12.[0004]The heat pipe 10 serves to diffuse or transmit heat energy. As for major processes of an operation, first, evap...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): F28D15/02F28D15/04
CPCF28D15/046F28D15/02G06F1/203H01L23/427H04M1/0202
InventorKIM, YONGDAEYEE, YOUNGJOO
OwnerLG ELECTRONICS INC