Substrate Carrier System for Moving Substrates in a Vertical Oven and Method for Processing Substrates

Abstract

A substrate carrier system for carrying substrates to a vertical oven and a vertical oven are disclosed. In an embodiment, the system includes a substrate carrier configured to carry a plurality of substrates and a substrate carrier support structure configured to be inserted along an insertion direction into the vertical oven, and to receive the substrate carrier in a direction substantially orthogonal to the insertion direction into a holding position in the substrate carrier support structure.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a divisional of U.S. patent application Ser. No. 14 / 444,889, filed on Jul. 28, 2014, which application is hereby incorporated herein by reference.TECHNICAL FIELD[0002]Embodiments relate to manufacturing processes in vertical ovens, and in particular to a method for oxidizing material or depositing material, a substrate carrier system for carrying substrates in a vertical oven, and a vertical low pressure chemical vapor deposition oven.BACKGROUND[0003]Wafers may be coated or oxidized in vertical ovens in a horizontal position in a vertically standing boat in a reactor. Wafers may be loaded and / or unloaded in a horizontal position into a boat, using a robot handling system. Layer deposition in vertical ovens may be carried out in the boat(s). A boat may be positioned on a pedestal and transported into and out of the reactor using an elevator. The wafer may be supported in a low pressure chemical vapor deposition (LPCVD) ...

AI Technical Summary

Benefits of technology

The patent text describes a method and system for oxidizing or depositing material onto substrates in a vertical oven. The substrates are held in predefined positions by a substrate carrier that is designed to fit into a vertical support structure. The substrates are inserted into the oven with their main surface at an angle of less than 20 degrees with respect to the vertical direction. The system and method allow for efficient and uniform oxidation or deposition of material on multiple substrates simultaneously. The technical effects are improved accuracy and precision in material formation on substrates.

Problems solved by technology

Due to the temperature load of the substrate material during the deposition, e.g. cooling and heating of the wafer, in the boat in a horizontal position, plastic deformation due to gravitation effects and higher warping of the wafer may occur.

This may lead to further problems during wafer handling and the wafer may no longer be able to be further processed.

Furthermore, during high temperature oxidation processes, slip lines may be created when overly large temperature changes, i.e. temperature delta, are applied to the wafer during the heating, oxidation or cooling phases.

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