Memory heater and heating aid arrangement

Abstract

A memory heater and heating air arrangement includes circuit module including circuit board, a plurality of memory modules mounted at the circuit board, memory heat sink wrapped around each memory module and locating member mounted at the circuit board around the memory modules, heating aid including flat heat-transfer base panel bonded to top side of the memory heat sinks, mounting structure located at the border of the flat heat-transfer panel and affixed to the locating member to secure the heating aid to the circuit module, and a heater attached to a top surface of the flat heat-transfer base panel of the heating aid and controllable by the circuit module to emit heat to the memory modules via the heating aid, enabling the memory modules to work under a cold environment. Subject to the functioning of the heating aid, one single heater is sufficient to heat the memories, saving the cost.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to computer memory heating technology and more particularly, to a memory heater and heating air arrangement, which uses a heating aid for transferring heat energy from one single heater to multiple memory modules, allowing the memory modules to work normally under a cold environment.[0003]2. Description of the Related Art[0004]Following fast development of computer technology, advanced computers with high computing capabilities and fast operating speed have been continuously created. With the trend of the development of computer technology toward high operating speed and high frequency, computer internal components and memories for these advanced computers will generate a large amount of heat during operation. The memory bandwidth has been extended from the early PC100 of 800 MB / s to the modern DDR500 of 4.0 GB / s, or even the multi-channel platform. Thus, the bandwidth has been increased mo...

AI Technical Summary

Benefits of technology

The present invention provides a memory heater and heating aid arrangement that can efficiently heat the memories of the memory modules even in a cold environment. The arrangement includes a circuit module, a memory heat sink, a locating member, a heating aid, a heater, and a thermal insulation material. The heater has a flat heat-transfer base panel that can be attached to the locating member, and a mounting structure is used to secure the heating aid to the circuit module. The heater emits heat through the heating aid to heat the memory modules, ensuring that they can work efficiently even in a cold environment. The combination of a single heater and a heating aid saves cost compared to previous arrangements. The thermal insulation material prevents heat from escaping upward, ensuring efficient heating of the memories. This arrangement is convenient to install, minimizes installation cost, and provides efficient heating of the memories.

Problems solved by technology

With the trend of the development of computer technology toward high operating speed and high frequency, computer internal components and memories for these advanced computers will generate a large amount of heat during operation.

However, if a computer is operated outdoors under climate extremes, high humidity and intense sunshine environments, it will be a very stringent test.

When using a computer in the day under a very large diurnal temperature environment (such as desert), computer internal heat dissipation device and fan can dissipate latent heat, maintaining normal memory functioning, however, when using a computer at night under low temperature or very cold outdoor environments (such as snow land), the memory in the computer will not be normally started up due to the temperature is too low.

However, because the motherboard for an advanced computer has multiple communication slots for the mounting of multiple memories, according to the conventional memory heating techniques, it needs to install a large amount of heaters in the motherboard for heating multiple memories, complicating heater installation procedure and leading to a high defective rate.

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