Distributed switches to suppress transient electrical overstress-induced latch-up

Abstract

Distributed switches to suppress transient electrical overstress-induced latch-up are provided. In certain configurations, an integrated circuit (IC) or semiconductor chip includes a transient electrical overstress detection circuit that activates a transient overstress detection signal in response to detecting a transient electrical overstress event between a pair of power rails. The IC further includes mixed-signal circuits and latch-up suppression switches distributed across the IC, and the latch-up suppression switches temporarily clamp the power rails to one another in response to activation of the transient overstress detection signal to inhibit latch-up of the mixed-signal circuits.

Description

FIELD OF THE DISCLOSURE[0001]Embodiments of the invention relate to electronic systems, and more particularly, to systems and devices for transient electrical overstress protection and latch-up prevention.BACKGROUND[0002]Certain electronic systems can be exposed to electrical overstress events, or electrical signals of short duration having rapidly changing voltage and high power. Electrical overstress events can include, for example, electrostatic discharge (ESD) events arising from the abrupt release of charge from an object or person to an electronic system.[0003]Electrical overstress events can damage or destroy integrated circuits (ICs) by generating overvoltage conditions and high levels of power dissipation in relatively small areas of the ICs. High power dissipation can increase IC temperature, and can lead to numerous problems, such as gate oxide punch-through, junction damage, metal damage, and surface charge accumulation.SUMMARY OF THE DISCLOSURE[0004]Distributed switches...

AI Technical Summary

Benefits of technology

The patent text describes a way to prevent damage to computer circuits caused by sudden power surges. It introduces a system that detects these surges and activates a circuit to clamp the power rails together, reducing the risk of damage to components. The technology can be applied to integrated circuits and semiconductor chips, and can help prevent malfunctions in computer hardware.

Problems solved by technology

Certain electronic systems can be exposed to electrical overstress events, or electrical signals of short duration having rapidly changing voltage and high power.

Electrical overstress events can damage or destroy integrated circuits (ICs) by generating overvoltage conditions and high levels of power dissipation in relatively small areas of the ICs.

High power dissipation can increase IC temperature, and can lead to numerous problems, such as gate oxide punch-through, junction damage, metal damage, and surface charge accumulation.

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