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Dressing board, use method of dressing board, and cutting apparatus

a dressing board and dressing board technology, applied in the direction of grinding machine components, manufacturing tools, abrasive surface conditioning devices, etc., can solve the problems of unreadable two-dimensional codes, limited relates to the dressing board, and small information that can be stored in the barcod

Inactive Publication Date: 2019-02-28
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text suggests using a two-dimensional code instead of a barcode on a dressing board because the amount of information that can be stored in a barcode is limited. However, if the region where the two-dimensional code is placed is cut by a cutting blade, the code becomes unreadable. This makes it difficult to check information related to the dressing board from the two-dimensional code when the dressing board is removed from a cutting apparatus and used again. The technical effect of this patent text is to promote the efficient use of a dressing board by using a two-dimensional code with a larger data storage capacity, while ensuring that the information related to the dressing board can be easily checked from the code even when the dressing board is removed and used again.

Problems solved by technology

However, the amount of information that can be stored in the barcode is small and the information that can be stored in the barcode and relates to the dressing board is limited.
However, when the region in which the two-dimensional code is disposed is cut by a cutting blade even partly, the two-dimensional code becomes unreadable.
For this reason, when use of the dressing board is suspended once and the dressing board is removed from a cutting apparatus and thereafter using the dressing board again is attempted, it is impossible to check the information relating to the dressing board from the two-dimensional code in some cases.

Method used

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  • Dressing board, use method of dressing board, and cutting apparatus
  • Dressing board, use method of dressing board, and cutting apparatus
  • Dressing board, use method of dressing board, and cutting apparatus

Examples

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Embodiment Construction

[0026]An embodiment relating to one aspect of the present invention will be described with reference to the accompanying drawings. The embodiment of the present invention is a dressing board, a use method of a dressing board, and a cutting apparatus.

[0027]FIG. 1 is a perspective view schematically depicting the dressing board according to the present embodiment. As depicted in FIG. 1, a barcode 3 and a two-dimensional code 5 are disposed on a surface of a dressing board 1. The dressing board 1 is used for dressing of a cutting blade mounted to a cutting apparatus. The cutting blade has a cutting abrasive containing abrasive grains and a bond material (binging material) that holds the abrasive grains. In the state in which the abrasive grains are moderately exposed from the bond material, the abrasive grains can get contact with a workpiece and thus the workpiece can be properly cut. However, in the case of an unused cutting blade or a cutting blade that has been worn and be lowered ...

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PUM

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Abstract

A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]The present invention relates to a dressing board used when dressing of a cutting blade is carried out, a use method of a dressing board, and a cutting apparatus including a cutting unit.Description of the Related Art[0002]In a manufacturing process of device chips, planned dividing lines in a lattice manner called streets are set on surfaces of wafers and devices are formed in the respective regions marked out by the planned dividing lines. When these wafers are cut along the planned dividing lines, individual device chips are formed. Among the wafers are wafer for semiconductor devices formed of silicon, gallium arsenide, or the like, wafer for optical devices formed of SiC (silicon carbide) or the like, package substrate including resin and metal, ceramic substrate, glass substrate, and so forth.[0003]The cutting is carried out by a cutting apparatus having a cutting unit including a cutting blade having a circular ring shape...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B24B27/06B24B53/00
CPCB24B27/0683B24B53/003B24B27/0076B24B27/06B24B41/02B24B41/06B24B49/12B24B51/00B24B53/06B24B53/12H01L21/78B24B27/0608H01L21/67092H01L21/67282H01L21/67294H01L21/76B24B49/186
Inventor SEKIYA, KAZUMA
Owner DISCO CORP
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