Workpiece grinding method

a workpiece and grinding method technology, applied in the field of workpiece grinding methods, can solve the problems of workpiece cracking and scratching on the ground surface of workpieces, and achieve the effect of restrainting the grinding ston

Inactive Publication Date: 2019-04-18
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a grinding method for a workpiece that prevents scratches and cracks on the back side of the workpiece. This is achieved by grinding the back side of the workpiece to form a circular recess and an annular reinforcement section, while preventing disturbances on the back side caused by the grinding process. The method utilizes the inclination of the workpiece to promote the discharge of grinding water containing abrasive grains from the grindstone, reducing the risk of troubles on the back side of the workpiece. The grinding water containing abrasive grains is discharged at the lowermost point of the chuck table, ensuring efficient grinding.

Problems solved by technology

When grinding by the grindstone with the dropped abrasive grains adhering to the grinding surface at the tip of the grindstone is continued, scratches may be formed on the ground surface of the workpiece or cracking of the workpiece may be generated.

Method used

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Examples

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Embodiment Construction

[0017]A workpiece W depicted in FIG. 1 is, for example, a semiconductor wafer which is circular plate-like in external form, the base material of which is silicon, and which is provided on a front side Wa thereof with a device region Wa1 and a peripheral surplus region Wa2 surrounding the device region Wa1. The peripheral surplus region Wa2 is that region of the front side Wa of the workpiece W which is on the outside of an imaginary line L1 represented by an alternate long and two short dashes line in FIG. 1. The device region Wa1 is partitioned in a grid pattern by a plurality of division lines (streets) S intersecting orthogonally, and a device D such as an IC is formed individually in each of regions partitioned in the grid pattern. A back side Wb of the workpiece W is a to-be-ground surface to be subjected to grinding. Note that the workpiece W may be formed from gallium arsenide, sapphire, gallium nitride, silicon carbide or the like, other than silicon.

[0018]Each of steps in ...

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Abstract

A method of grinding a back side of a workpiece having a device region and a peripheral surplus region on a front side thereof includes covering the front side of the workpiece with a protective member, holding a protective member side of the workpiece by a holding surface of a chuck table that is rotated around a rotational axis inclined at an angle of 45 to 180 degrees relative to a vertical direction, and grinding the back side of the workpiece corresponding to the device region by a grindstone rotated around a rotational axis orthogonal to the holding surface while supplying grinding water, to form a circular recess and an annular reinforcement section surrounding the circular recess. When grinding, discharge of the grinding water containing abrasive grains dropped from the grindstone is promoted by the inclination of the workpiece.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]The present invention relates to a method of grinding a plate-shaped workpiece such as a semiconductor wafer by a grindstone.Description of the Related Art[0002]A workpiece in which a plurality of devices such as integrated circuits (ICs) and large scale integrations (LSIs) formed on a front side thereof has its back side ground to be thinned to a predetermined thickness, and is further divided by a dividing apparatus such as a dicing apparatus into individual device chips, which are used for various electronic apparatuses.[0003]A grinding apparatus for grinding the back side of the workpiece includes a chuck table adapted to hold the workpiece to which a front side protective member formed of a resin or the like is adhered, a grinding unit in which a grindstone for grinding the workpiece held by the chuck table is rotatably supported, and grinding water supplying means supplying grinding water to the grindstone through a flow p...

Claims

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Application Information

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IPC IPC(8): B24B7/22
CPCB24B7/228H01L21/304H01L21/3046B24B41/068B24B57/02B24B55/03
InventorKAKEFUDA, MASAKI
OwnerDISCO CORP