Substrate structure, semiconductor package structure including the same, and semiconductor process for manufacturing the same

Abstract

A substrate structure includes a dielectric layer, a first circuit layer, a second circuit layer and at least one conductive pillar. The dielectric layer has a first surface and a second surface opposite to the first surface. The first circuit layer is disposed adjacent to the first surface of the dielectric layer. The second circuit layer is disposed adjacent to the second surface of the dielectric layer and electrically connected to the first circuit layer. The second circuit layer includes a plurality of pads and at least one trace disposed between two adjacent pads of the plurality of pads. The at least one conductive pillar is tapered toward the second circuit layer and disposed on one of the pads. A portion of the second surface of the dielectric layer is exposed from the second surface layer.

Description

BACKGROUND1. Field of the Disclosure[0001]The present disclosure relates to a substrate structure, a semiconductor package structure and a manufacturing method, and to a substrate structure including at least one tapered conductive pillar, a semiconductor package structure including the substrate structure, and a method for manufacturing the substrate structure.2. Description of the Related Art[0002]In an electronic device, functionality improvement and size reduction can be achieved by changing the materials thereof, or by changing the structural design thereof. When the materials of the electronic device are changed, the settings or parameters of production equipment and the manufacturing methods may be modified accordingly, which can be complicated and expensive as compared to adjusting the structural design thereof. An efficient way for improving functionality and reducing size of the electronic device is achieved by a structural design with a reduced line width / line space (L / S)...

AI Technical Summary

Benefits of technology

This patent describes a substrate structure and a semiconductor package structure that includes a dielectric layer, first and second circuit layers, and at least one conductive pillar. The conductive pillar is tapered downwardly and disposed on one of the pads of the second circuit layer. The substrate structure also includes a semiconductor die that is electrically connected to the conductive pillar. An encapsulant is disposed between the substrate structure and the semiconductor die. The patent also describes a process for making the substrate structure and the semiconductor package structure. The technical effects of this patent include enhanced performance and reliability of semiconductor devices that utilize conductive pillars.

Problems solved by technology

When the materials of the electronic device are changed, the settings or parameters of production equipment and the manufacturing methods may be modified accordingly, which can be complicated and expensive as compared to adjusting the structural design thereof.

However, an input / output (I / O) count and a total thickness of such an electronic device are issues of concern.

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