Dynamic random access memory device

a random access and memory device technology, applied in the field of dynamic random access memory devices, can solve problems such as operation failures, and achieve the effect of reducing failures caused during operation

Active Publication Date: 2019-06-13
SAMSUNG ELECTRONICS CO LTD
View PDF0 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]According to embodiments of the present inventive concept, a dynamic random access memory (DRAM)

Problems solved by technology

Accordingly, when a charge sharing operation is performed between a capacitor of each of the memory cells connected to the selected wo

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dynamic random access memory device
  • Dynamic random access memory device
  • Dynamic random access memory device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019]Hereinafter, dynamic random access memory (DRAM) devices according to example embodiments of the present inventive concept will be described with reference to the accompanying drawings.

[0020]FIG. 1 is a diagram that illustrates an arrangement and a configuration of a DRAM device according to an example embodiment of the present inventive concept.

[0021]Referring to FIG. 1, a DRAM device 100 may include a memory cell array 10, first row decoders 20-11 to 20-14, second row decoders 20-21 to 20-23, column decoders 30-11 to 30-14, control signal generators (CSG) 30-21 to 30-24, a voltage generator 40, a dummy bit line controller 50, and a switch SW.

[0022]The memory cell array 10 may include four X memory cell array blocks XBLK1 to XBLK4 arranged in a bit line direction Y. The four X memory cell array blocks XBLK1, XBLK2, XBLK3, and XBLK4 may include four sub memory cell array blocks MCA11 to MCA14, MCA21 to MCA24, MCA31 to MCA34, and MCA41 to MCA44, respectively. The memory cell ar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A dynamic random access memory (DRAM) device includes a memory cell array including a first sub memory cell array block including a plurality of first memory cells between a plurality of first sub word lines, and a plurality of first odd-numbered bit lines and a plurality of dummy bit lines and includes a second sub memory cell array block including a plurality of second memory cells between a plurality of second sub word lines, a plurality of second odd-numbered bit lines, and a plurality of second even-numbered bit lines. The memory cell array may be arranged to have an open bit line architecture in which the plurality of first odd-numbered bit lines and the plurality of second even-numbered bit lines form bit line pairs. When the first sub word line may be selected, a predetermined voltage may be applied to the plurality of dummy bit lines for a first predetermined period in which a charge sharing operation is performed on the plurality of first memory cells connected to the selected one of the plurality of first sub word lines.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This U.S. non-provisional patent application claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2017-0168152, filed on Dec. 8, 2017, in the Korean Intellectual Property Office (KIPO), the content of which is hereby incorporated herein by reference in its entirety.BACKGROUND1. Field[0002]The present inventive concept relates generally to semiconductor memory devices and, more particularly, to dynamic random access memory devices.2. Discussion of Related Art[0003]Dynamic random access memory (DRAM) devices may have an open bit line architecture or a folded bit line architecture according to an arrangement of bit lines.[0004]A DRAM device having an open bit line architecture may include a plurality of memory cell array blocks arranged in a bit line direction. In a plurality of memory cell array blocks extending in a bit line direction, those memory cell array blocks disposed at the ends thereof may include dummy bit lin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G11C11/4094G11C11/408G11C11/4099G11C11/4091G11C11/4096
CPCG11C11/4094G11C11/4085G11C11/4099G11C11/4091G11C11/4096G11C11/4087G11C11/4097G11C2207/002G11C2207/005
Inventor SUNG, KI JONGKIM, DAE SUNKIM, JIN SEONNAM, IN CHEOL
Owner SAMSUNG ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products