Method for grinding and/or polishing a defect and device for carrying out the method

Abstract

A method for grinding and / or polishing a defect in the surface coating of a workpiece involves holding a grinding or polishing disc held on a tool and guiding the disc with pressure over the defect with orbital, rotating and / or vibrating movements. The tool fitted with the grinding or polishing disc is moved over the defect automatically and in a computer-controlled manner based on a stored program, wherein the grinding or polishing disc is first guided along a concentrically inner grinding path relative to the defect and then without interruption is guided along a spiral grinding path to an outer concentric grinding path.

Description

BACKGROUND AND SUMMARY OF THE INVENTION[0001]Exemplary embodiments of the invention relate to a method for grinding and / or polishing a defect in the surface coating of a workpiece and a device for carrying out the method.[0002]Especially in the case of defects in painted surfaces, such as car bodies, these defects are ground at points and this grinding point is then polished. In this case, the grinding and polishing tool, on which a grinding or polishing disc is held, is manually guided by an operator who performs corresponding grinding movements under contact pressure.[0003]A backing pad of the grinding or polishing tool, on which the grinding or polishing blade is held, moves in an orbital, rotating, or vibrating manner due to the machine design, i.e., the backing pad performs a movement which cannot be influenced by the machine operator.[0004]In addition to the correct choice of abrasive and polishing paste, the contact pressure and the grinding or polishing movement are decisive...

AI Technical Summary

Benefits of technology

The patent describes a method for grinding and polishing defects in a circular path using a grinding or polishing disc. The disc is tilted inwards by a predetermined angle, creating a taper angle that increases the grinding power at the center of the path. This makes it easier and quicker to grind the defect. The method also reduces the amount of abrasive required, saving energy, and allows for reproducible polishing results.

Problems solved by technology

When processing a horizontal surface, the contact pressure results in this case from the mass of the grinding tool and the additional manually applied force on the surface.

However, an optimum and constant contact pressure during grinding or polishing of the surface cannot be ensured so far, i.e., manually.

This applies equally to an optimum and constant movement of the grinding tool, wherein an exact central positioning to the defect to be machined is only possible to a limited extent due to the shape and size of the grinding tool and the backing pad.

As a consequence, there is an additional effort for post-processing, which, moreover, produces a corresponding result only in an unacceptable spread width.

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