Magnetoresistive element including two ferromagnetic layers
a magnetoresistive element and ferromagnetic layer technology, applied in the field of magnetoresistive elements, can solve the problems of insufficient bias magnetic field, large variation in output of the read head, and low yield of the read head
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first embodiment
[0058]Embodiments of the present invention will now be described in detail with reference to the drawings. Reference is first made to FIG. 4 and FIG. 5 to outline the configuration and manufacturing method of a thin-film magnetic head of a first embodiment of the invention. FIG. 4 is a cross-sectional view illustrating a cross section of the thin-film magnetic head perpendicular to the medium facing surface and the top surface of the substrate. FIG. 5 is a cross-sectional view illustrating a cross section of a pole portion of the thin-film magnetic head parallel to the medium facing surface.
[0059]The thin-film magnetic head of the embodiment has a medium facing surface 20 that faces toward a recording medium. The thin-film magnetic head includes: a substrate 1 made of a ceramic material such as aluminum oxide and titanium carbide (Al2O3—TiC); an insulating layer 2 made of an insulating material such as alumina (Al2O3) and disposed on the substrate 1; a first shield 3 made of a magne...
second embodiment
[0140]A second embodiment of the invention will now be described. FIG. 20 is a cross-sectional view illustrating a cross section of an MR element of the second embodiment perpendicular to the medium facing surface 20 and the top surface of the substrate 1. In the MR element of the second embodiment, out of the high saturation magnetization layer 43A and the hard magnetic layer 43B of the bias magnetic field applying layer 43, at least the high saturation magnetization layer 43A is formed by lift-off.
[0141]Reference is now made to FIG. 21 to FIG. 25 to describe a method of manufacturing the MR element of the second embodiment. The steps of the method of manufacturing the MR element of the second embodiment are the same as those of the first embodiment up to the step of forming the MR stack 30 by patterning the multilayer film for the MR stack 30 using the mask 53 (see FIG. 12).
[0142]FIG. 21 illustrates the next step. In this step, first, with the mask 53 of FIG. 12 left unremoved, th...
third embodiment
[0158]A third embodiment of the invention will now be described. FIG. 26 is a top view of the MR stack 30 and the bias magnetic field applying layer 43 of the MR element of the third embodiment. As shown in FIG. 26, the plane geometry of the bias magnetic field applying layer 43 of the third embodiment includes a first portion 431, and a second portion 432 located between the first portion 431 and the rear end face 30b of the MR stack 30. The first portion 431 and the second portion 432 are each rectangular in shape. The dimension W2 of the second portion 432 taken in the direction parallel to the front end face 30a of the MR stack 30 is smaller than the dimension W1 of the first portion 431 taken in the direction parallel to the front end face 30a.
[0159]The bias magnetic field applying layer 43 of the third embodiment includes the high saturation magnetization layer 43A and the hard magnetic layer 43B, like the first and second embodiments. The position of the boundary between the...
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Abstract
Description
Claims
Application Information
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