Temperature control method and temperature control device

Abstract

In a temperature control method, a controlled part is arranged to contact a first principal surface of a heat conduction part. The heat conduction part has the first principal surface and a second principal surface opposite to the first principal surface. The first principal surface has a configuration corresponding to a configuration of the controlled part. The second principal surface is larger in surface area than the first principal surface. At least one of a heating unit and a cooling unit is driven to set the controlled part at a predetermined temperature. The heating unit and the cooling unit are disposed on the second principal surface of the heat conduction part so that the heating unit and the cooling unit are arranged side by side.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is based upon and claims the benefit of priority of Japanese Patent Application No. 2005-132550, filed on Apr. 28, 2005, the entire contents of which are herein incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention generally relates to a temperature control method and a temperature control device for use in the temperature control method. In particular, the present invention relates to a temperature control method in which a controlled part, such as an electronic part, is subjected to heating or cooling so that the controlled part is set at a given temperature different from a normal temperature, in order to carry out evaluation and / or testing of the controlled part.[0004]2. Description of the Related Art[0005]In the following, the electronic parts are semiconductor integrated circuit devices, such as IC and LSI, which will be referred to as semiconductor devices.[...

AI Technical Summary

Benefits of technology

This approach enables efficient and accurate temperature control of semiconductor devices with high power consumption, preventing thermal stress and allowing for precise evaluation of temperature characteristics without causing thermal damage.

Problems solved by technology

While the electronic parts are required to attain high integration and advanced features, the environment and conditions in which they are used have become severe.

As a result, the increase of the electric power which is consumed by a single semiconductor device (semiconductor chip), i.e., the raise of the power consumption, is progressing.

The operation of a semiconductor device causes a temperature rise due to the self-heating and the surrounding environment, and the operation of the semiconductor device becomes unstable.

Therefore, the checking and compensating of the operating characteristics cannot be performed to various kinds of semiconductor devices with which the heat generating characteristics differ under the controlled temperature condition or at a constant low temperature.

Also when conducting the testing for checking and compensating the operating characteristic of a semiconductor device, the power consumption, i.e., the temperature of a semiconductor device, will change with the respective testing items sharply.

The heat capacity of the heating medium part is comparatively small, and the rapid temperature change in the electronic part cannot be absorbed or diffused.

And the electronic part is subjected to the rapid cooling by the thermoelectric effect element, and a thermal damage will be given to the electronic part.

The passage of the heat conduction is comparatively long, the heat capacity is comparatively large, and it is difficult to achieve rapid cooling or rapid heating of the semiconductor device.

According to the above composition, there is no unit for cooling directly the semiconductor device (the evaluated / tested electronic device) to a lower temperature, and it is difficult to conduct the above-mentioned evaluation or testing of the semiconductor device in such a cold condition.

The heat conduction passage is long, and the heat capacity is comparatively large, and it is difficult to carry out prompt cooling or heating of the semiconductor device.

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