Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor device, semiconductor memory device and data processing system comprising semiconductor system

a semiconductor memory and memory device technology, applied in the field of semiconductor memory devices and data processing systems comprising semiconductor systems, can solve the problems of increasing reducing the data retention time of the memory cell, and increasing the boost voltage required for driving word lines, etc., to achieve excellent operating margin for the sense amplifier, reduce the write voltage of the memory cell, and high speed operation

Active Publication Date: 2015-12-15
LONGITUDE LICENSING LTD
View PDF24 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention aims to reduce the write voltage for the memory cell, increase the operating margin and speed of the sense amplifier, while also reducing power consumption and cost. By reducing the write voltage, the signal voltage obtained by reading data from the memory cell can be transformed into the operating voltage of the sense node and transferred via the sense node, ensuring excellent sensing operation. Additionally, the capacitance of the capacitor in the memory cell is maintained, reducing the risk of capacitance-related failure and improving data retention time. The reduced write voltage also decreases the potential at the P-N junction portion, reducing leak current and stabilizing the memory cell's operation. Furthermore, reducing the write voltage decreases the area required for a boost power supply circuit and achieves cost reduction.

Problems solved by technology

However, the configuration of the above conventional semiconductor memory device is mainly intended to achieve high-speed operation of the sense amplifier, and it is not taken into consideration that a write voltage for the memory cell is set sufficiently lower than an operation voltage of the sense amplifier.
That is, when the write voltage for the memory cell is relatively large, consumption current increases due to charge / discharge current of the bit line.
Further, data retention time of the memory cell is shortened due to influence of leak current from the memory cell (data storage node, exactly) to a substrate, and this causes various problems such as an increase in a boost voltage required for driving word lines.
Thus, there arises a problem that it is difficult for the sense amplifier to normally operate, or a problem that operating speed of the sense amplifier increases even if it operates.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device, semiconductor memory device and data processing system comprising semiconductor system
  • Semiconductor device, semiconductor memory device and data processing system comprising semiconductor system
  • Semiconductor device, semiconductor memory device and data processing system comprising semiconductor system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030]Typical examples of a technical idea solving the problems of the present invention will be shown. However, it goes without saying that the present invention is not limited to the examples of the technical idea and consists in the scope of the claimed invention.

[0031]The technical idea of the present invention is that data (charge amount) of a memory cell (a capacitor) is read out to a bit line, a sense amplifier in which the bit line is connected to a gate of a transistor is configured to amplify the potential of the bit line to an operation voltage of the sense amplifier, a third voltage (VARY) corresponding to high-level data (generally corresponding to “1”) of the memory cell is set lower than a second voltage (VDD) as the operation voltage of the sense amplifier, while the third voltage (VARY) is set higher than a transfer control voltage (VTG) applied to a gate of a transfer transistor (transfer gate) of a transfer control circuit placed between the bit line and the gate ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A semiconductor device comprises a memory cell, a bit line, a sense amplifier operating between a first voltage and a second voltage higher than the first voltage, a transfer control circuit including a transfer transistor, and a write circuit writing data into the memory cell through the bit line based on the first voltage and a third voltage. The sense amplifier receives and amplifiers the signal voltage at a sense node when the transfer transistor controls the connection between the bit line and the sense node in response to a transfer control voltage. The third voltage is set to a voltage lower than the second voltage and higher than the transfer control voltage, and the sense node is set to a voltage higher than the transfer control voltage in an initial period of a read operation before the data of the memory cell is read out to the bit line.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a semiconductor device having a configuration in which data stored in memory cells is read out to bit lines and amplified by sense amplifiers.[0003]2. Description of Related Art[0004]Conventionally, semiconductor memory devices each provided with a sense amplifier which senses and amplifies data read out from a memory cell to a bit line have been known (Refer to, for example, Patent References 1 and 2). Further, a memory circuit using a charge transfer amplifier is known in relation to the Patent Reference 1 (Refer to Non-Patent References 1, 2 and 3). Particularly, the Patent Reference 1 discloses a memory cell MC of a gain cell type (a kind of DRAM cells) in which a gate of an output transistor M1 is used as a storage node SN shown in FIG. 8 and description thereof. This memory cell MC stores data in a capacitor (not shown) connected to the storage node SN. Operation of the memory cell...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(United States)
IPC IPC(8): G11C11/24G11C11/4091G11C11/404G11C7/06
CPCG11C11/404G11C11/4091
Inventor KAJIGAYA, KAZUHIKO
Owner LONGITUDE LICENSING LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products