Method and devoce for arranging conductive metal wire on display faceplate possessing point discharge

Abstract

The invention follows ITO wiring mode (arc shape at turning point, conducting metal wire frame covers periphery of straight conducting metal wire). Under condition of not affecting on LCD screen and value of resistance of wiring, adding sharp-angled metal pattern causes electric static discharging to wiring pattern in releasing zone so as to reach following purposes: dissipation of static electricity, preventing wires from burning, and preventing module from inference from static.

Description

technical field [0001] The present invention relates to a method and device for laying out conductive metal wires of a display panel with tip discharge, and in particular to a method that can apply the principle of tip discharge to the layout of LCD metal lines (ITO), so that the LCD module can operate in a very short time. Dissipating the electrostatic charge to improve the antistatic ability is a very innovative design idea. Background technique [0002] In view of the fact that when the LCD module encounters an instantaneous surge of electrostatic charge, it is easy to cause the LCD conductive metal line (ITO) to burn out, thereby affecting its module function. Therefore, it is necessary to integrate an electrostatic protection device in the overall module design, and the general design requires Adding an electrostatic protection circuit or component increases the volume of the LCD module or IC and increases the cost. [0003] For example, the US patent application No. 2...

AI Technical Summary

Problems solved by technology

[0012] 1. Add capacitors or anti-static components to the glass: the disadvantage is that it is not easy to realize in the manufacturing process, because the glass is easy to break when connecting (Bonding) components on the machine, and the wiring space becomes smaller, and the design space is relatively smaller

[0013] 2. Design an ESD protection device on the FPC: the disadvantage is that it cannot completely prevent the harm of static electricity, because static electricity does not completely enter from the FPC, and may also enter from the ITO on the glass

[0014] 3. Simply increase the impedance value of the wiring: the disadvantage is that when the power is converted into heat energy, it is easy to cause heat concentration due to the change of the thickness of the wiring, which is not easy to dissipate heat and burn the short circuit

[0015] 4. The impedance value is too low: the electrostatic protection function cannot be achieved

[0016] 5. Too high impedance value: digital and analog signals will be attenuated due to too high impedance, which will affect the working performance of IC

Images