Wafer radiating element

Abstract

The chip heat radiating element is for chip to radiate heat. The chip heat radiating element has one top plate and side walls, and the top plate is bent and extended to connected side walls and has notched part to contact with chip.

Description

technical field [0001] The present invention relates to a chip cooling element, in particular to a chip cooling element using a recessed plate portion. Background technique [0002] Generally, the heat sink and the surface of the chip in the chip package assembly will be separated by molding resin (Epoxy Molding Compound, EMC), so as to use the molding resin to protect each circuit connected between the chip and the substrate to prevent short circuit. However, because the heat dissipation properties of the molding resin are not good, the heat dissipated by the heat source cannot be dissipated properly through the molding resin, and then the reliability of the chip package assembly is likely to be shortened. [0003] As shown in FIG. 1A , a known structure of a chip package assembly 11 is applied to a chip 18 . The wafer cooling element 11 has a top plate 13 , a side wall 15 and a bottom plate 17 . The top plate 13 is bent and extended to connect to the side wall 15 , and t...

AI Technical Summary

Problems solved by technology

However, although there are known methods to reduce the injection speed of the molding resin 191 to reduce the probability of the air holes 193, it will affect the overall filling process time.

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