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Image sensor

A technology of image sensor and sensing layer, which is applied in image communication, TV, color TV parts, etc. It can solve the problems of large sensor size, inability to change, sensor design and use problems, etc.

Inactive Publication Date: 2008-07-23
VISERA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the composition structure of the above-mentioned CMOS sensor 90, because the amount of light that the sensing chip 92 can receive is only controlled by the lens group 94 of the bearing seat 93, the optical characteristics of the sensor 90 are relatively simple, and cannot At the same time, the sensor 90 must use the bearing seat 93 and the positioning seat 96 to fix the lens 94 and the filter plate 97, thus resulting in a larger volume of the overall sensor. At the same time, sensors with a large volume often cause troubles in design and collocation, making it difficult to reduce the size of electronic products

Method used

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Embodiment Construction

[0029] see figure 1 Shown is the image sensor 10 provided by the first preferred embodiment of the present invention. The image sensor 10 includes a sensing chip 20, a board body 30, a filter layer 40, a light shielding layer 41, and a lens 50. .

[0030] The sensing chip 20 is a complementary metal oxide semiconductor chip (Complementary Metal-Oxide Semiconductor, CMOS) made by means of CSP (Chip Scale Package). The packaging form of the chip 20 is in the form of BGA. An optical sensing layer 21, a silicon crystal layer 22, and a structural layer 23; the optical sensing layer 21 is formed on the silicon crystal layer 22, and the epoxy resin (EPOXY) 24 is passed between the silicon crystal layer 22 and the structural layer 23 Combining with each other, the optical sensing layer 21 is electrically connected to a plurality of hemispherical solder bumps (Solder Bump) 26 disposed on the bottom surface of the structure layer 23 by wires 25 .

[0031] The plate body 30 is made of...

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Abstract

The image sensor includes a sensing chip, a plate body, a filter layer, a shading layer, and a lens. The sensing chip possesses an optical sensing layer. The plate body is transparent. Optical sensing layer is setup on one side of the plate body, and filtering layer covers on another side of the plate body. Covering filtering layer, the shading layer is in use for controlling amount light beam passes through, and lens is setup on the shading layer.

Description

technical field [0001] The present invention relates to an image sensor, in particular to an image sensor with better optical characteristics. Background technique [0002] Various common digital image retrieval devices, whether it is a digital camera, a digital video camera, or a camera-capable mobile phone, etc., the key to determining image quality lies in the image sensor in each image retrieval device; currently the main image sensor can be It is divided into two types: Charge Coupled Device (hereinafter referred to as CCD) sensor and complementary metal oxide semiconductor (Complementary Metal-Oxide Semiconductor, hereinafter referred to as CMOS) sensor. Because CMOS sensor has power saving, small size, and relatively price The advantage of being relatively cheap, therefore, even though the image quality of CMOS sensors is poor, they are still widely used in consumer electronics products such as optical mice and camera phones. [0003] General CMOS image sensor 90, su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/30
Inventor 戎柏忠林孜翰刘芳昌
Owner VISERA TECH CO LTD