Positioning apparatus and method of controlling positioning apparatus

A technology of positioning equipment and controller, applied in the field of chip mounter and controlling the positioning equipment, can solve the problems of complex structure of exposure equipment, increase in cost, etc., and achieve the effect of simple structure and cost reduction
CN100411093CInactive Publication Date: 2008-08-13FUJITSU LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
FUJITSU LTD
Publication Date
2008-08-13
Estimated Expiration
Not applicable · inactive patent

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Abstract

A movable member moves along a predetermined guide path. A supporting member extends from the movable member. A processing unit is fixed to the tip end of the supporting member. A sensor detects the movement of the movable member. When the movable member has stopped moving, the processing unit is subjected to a transient due to the inertia acting on the processing unit. The transient is detected based on the waveform of the sensor signal. The position of the processing unit can thus precisely be detected based on the sensor signal. The time for starting the operation of the processing unit can optimally be determined. The processing unit is thus allowed to start operating at the determined time. The processing unit is allowed to start operating in a shorter time after the movable member has stopped moving, even when the transient remains in the processing unit.
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Description

technical field

[0001] The present invention relates to positioning equipment contained in handling or processing equipment, such as chip mounters designed to mount electronic component chips onto printed circuit boards. The invention also relates to a method of controlling the positioning device. Background technique

[0002] For example, as disclosed in Japanese Patent Application Laid-Open No. 2003-124112, exposure equipment is generally utilized in fine processing of wafers. Optical units, masks, etc. are aligned with the wafer placed on the stage in the exposure apparatus. For example, the stage moves in the horizontal direction to position the optical unit and mask. There is still a transition in the workbench after the workbench has stopped moving. The optical unit and mask are driven to move synchronously with the transition process. Optical units and masks can be aligned to the wafer without errors. Position deviation can be eliminated. Precise alignment is ob...

Claims

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