Unlock instant, AI-driven research and patent intelligence for your innovation.

Stacking-type image induction module

An image sensing and sensing unit technology, which is applied in the field of image sensing modules, can solve the problems such as the difficulty of reducing the volume, the large size of the image sensor, and the trouble of product design.

Inactive Publication Date: 2008-10-01
VISERA TECH CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the structure of the above image sensor, since the image sensor chip and the digital signal controller must be integrated with a circuit board, the overall image sensor is relatively large in size, and when the image sensor is applied to electronic products, electronic products The space where the components can be set will be occupied by the image sensor, making it difficult to reduce the size of the product and causing troubles in product design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stacking-type image induction module
  • Stacking-type image induction module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Hereinafter, two preferred embodiments are cited in conjunction with the accompanying drawings to illustrate the structure and effects of the present invention in detail.

[0020] See figure 1 Shown here is the stacked image sensor module (10) provided by the first preferred embodiment of the present invention. The image sensor module (10) includes a sensor unit (20), a signal processing unit (30), and a plurality of solder joints ( 50), and a lens group (60).

[0021] The sensing unit (20) includes a photosensitive chip (21) and a package (22). The photosensitive chip (21) is a Complemen-tary Metal-Oxide Semiconductor (CMOS), and the package (22) is Epoxy material, the photosensitive chip (21) has many contacts (23), the package (22) has many through holes (24) corresponding to the positions of the contacts (23); the sensor unit (20) uses a wafer Wafer Level Chip Scale Package (WLCSP) is made, so that the sensing unit (20) forms a first side (25) and a second side (26), t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Stack type image sensing module includes a sensing unit, a signal process unit, multiple soldered points, and a lens group. The sensing unit possesses a first face and a second face. The second face possesses multiple first electro-conductive parts; and the signal process unit possesses multiple second electro-conductive parts. The signal process unit is setup at fist face of the sensing unit. Each second electro-conductive part is connected to each first electro-conductive part electrically. Each soldered point is connected to each second electro-conductive part. Being setup at second face of the sensing unit, the lens group covers each first electro-conductive part.

Description

Technical field [0001] The present invention relates to an image sensor module, and particularly refers to a stacked image sensor module. Background technique [0002] More and more electronic products have digital camera functions, such as mobile phones, PDAs, or notebook computers, etc., and the above-mentioned electronic products with camera functions usually have an image sensor; a known image sensor is directly connected to A flexible circuit board (FPC) is equipped with an image sensor chip and a multi-chip module. The multi-chip module has a digital signal controller (Digital Signal Processor, DSP), a memory chip, and other electronic components. If the image sensor chip and the multi-chip module are electrically connected to each other, the image sensor can be directly used on electronic products. [0003] However, in the above-mentioned image sensor structure, since the image sensor chip and the digital signal controller must be integrated with a circuit board, the overa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/30
CPCH01L2224/18
Inventor 戎柏忠林孜翰刘芳昌
Owner VISERA TECH CO LTD