Check patentability & draft patents in minutes with Patsnap Eureka AI!

Slave device, master device and stacked device

A technology of slave devices and stacked devices, which is applied in the fields of climate sustainability, semiconductor devices, information technology support systems, etc., and can solve the problems of complex manufacturing process and difficult to form with high precision.

Inactive Publication Date: 2008-11-12
PANASONIC CORP
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In addition, in Patent Document 1, it is necessary to deliberately form oblique penetrating wirings in order to make each semiconductor device into a selected state.
The formation of oblique through wiring requires special processing, and it is not easy to form with high precision.
In addition, it is necessary to provide two types of through-wiring, vertical through-wiring used for connection between control terminals and oblique through-wiring used for connection between CS terminals, and the manufacturing process becomes complicated.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Slave device, master device and stacked device
  • Slave device, master device and stacked device
  • Slave device, master device and stacked device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach example

[0097] (Outline of lamination device)

[0098]FIG. 1A is a schematic diagram of a lamination device according to a first embodiment of the present invention, and FIG. 1B is a schematic diagram showing terminal configurations of a slave device and a master device in FIG. 1A . The stacking device 1000 is sequentially stacked with a master device 100 that controls each stacked slave device, and first to third slave devices 110 , 120 , and 130 that perform various controls based on commands from the master device. The terminals α of the master device 100 and each slave device are constituted by the same terminal arrangement as shown in FIG. 1B which is a plan view of each terminal. Therefore, when the master device 100 and each slave device are laminated, the terminals α of each device are in contact with each other. In addition, in each slave device, a penetrating wiring β penetrating through the slave device constituted by the substrate is provided corresponding to each termina...

no. 2 Embodiment approach example

[0153] (Configuration of lamination device)

[0154] (1) Overall composition

[0155] The terminals of the master device and each slave device have the same terminal arrangement as those shown in FIGS. 1A and 1B of the first embodiment.

[0156] Figure 8 It is a cross-sectional configuration diagram of a lamination apparatus related to the second embodiment. In the stacking device 2000 , a master device 200 , a first slave device 210 , a second slave device 220 , a third slave device 230 , and a fourth slave device 240 are stacked. In addition, the terminals include a plurality of control terminals to which control signals for each slave device to perform various processes are input, and a plurality of CS terminals to which identification commands from the master device 200 are input. The example shown here is an example in which four slave devices are stacked, but the number of stacks is not limited.

[0157] (2) CS terminal configuration and CS terminal connection confi...

no. 3 Embodiment approach example

[0212] (summary)

[0213] A stacked device is formed by stacking a plurality of slave devices with the same terminal arrangement and a master device. Here, the master device has a command transmission mechanism for inputting a random number generation command to a terminal of an adjacent slave device to start generating a random number, and receiving random numbers generated by each slave device, and judging whether the values ​​are different from each other. The judging mechanism of the random number, and the identification ID receiving mechanism for receiving the identification ID of each slave device set corresponding to the random number generation command from each slave device, and the correspondence for storing each slave device in correspondence with each identification ID Storage institution. In addition, the slave device has a through wiring for connecting an adjacent slave device to at least one terminal of the own device, a command receiving mechanism for receivin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Resistanceaaaaaaaaaa
Login to View More

Abstract

A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.

Description

technical field [0001] The invention relates to a stacked device formed by stacking a master device and a plurality of slave devices, as well as the slave device and the master device. Background technique [0002] Currently, a multilayer device is being developed in which a plurality of semiconductor devices each executing various processes and a control device such as a CPU for controlling each semiconductor device are stacked on a board. By laminating the semiconductor device on the wiring board in this way, it is possible to reduce the size and weight of a product including the semiconductor device. Here, each semiconductor device is given a unique identification ID in advance at the stage of on-wafer manufacturing. The control device can access each semiconductor device based on the unique identification ID, and can control each semiconductor device. [0003] In addition, Patent Document 1 discloses a method for identifying semiconductor devices mounted three-dimensio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/00H01L21/00
CPCY04S20/242Y02B70/3266H01L2224/16145
Inventor 中山武司高桥英治齐藤义行石丸幸宏岩城秀树
Owner PANASONIC CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com