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Photoelectric element package process

A technology for optoelectronic components and packaging technology, applied in electrical components, circuits, semiconductor devices, etc., to achieve the effect of improving the rate of good

Active Publication Date: 2008-11-26
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] The purpose of the present invention is to overcome the defects in the existing photoelectric element packaging process and provide a new photoelectric element packaging process. The technical problem to be solved is to make it suitable for avoiding the photoelectric element from being polluted in the packaging process, thereby more practical

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Embodiment Construction

[0045] In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the specific implementation methods, methods, steps, features and details of the optoelectronic component packaging process proposed according to the present invention will be described below. Its effect is described in detail below.

[0046] see Figure 2A-2H Shown is the process flow and structural cross-sectional view of the optoelectronic element packaging process of a preferred embodiment of the present invention, and image 3 It is a schematic cross-sectional view of the wire bonding structure used in the packaging process of optoelectronic components.

[0047] See first Figure 2A As mentioned above, in the photoelectric device packaging process of this embodiment, a wafer 210 is provided first. The wafer 210 is composed of a substrate 212 an...

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Abstract

This invention relates to a package process for photoelectric elements, which provides a wafer including a base and multiple photoelectric elements matched on the surface of the base, every element has an active surface exposed out of the base and a pattern protection layer is formed on it, then the wafer is cut to form multiple chips and each has at least one photoelectric element, then the chips are connected to multiple loaders and the pattern protection layer is removed finally.

Description

technical field [0001] The invention relates to a component packaging process (packaging process), in particular to a photoelectric device (photoelectric device) packaging process. Background technique [0002] In today's information-explosive society, electronic products are pervasive in daily life, whether in food, clothing, housing, transportation, or entertainment, etc., they will be applied to products composed of integrated circuit components, and with the continuous evolution of electronic technology, functions Products that are more complex and humanized are constantly being introduced. Since images are always the most acceptable way for people to express information, among all kinds of electronic products, such as digital cameras, digital video cameras, mobile phones with camera or video functions, scanners and other optical and electronic products, they have naturally become the most popular. consumer electronics. In optical electronic products, the most importan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18
CPCY02P70/50
Inventor 陈智龙许健豪
Owner ADVANCED SEMICON ENG INC