Method for testing product fault-tolerant performance and fault inserting device thereof

A fault-tolerant test and fault insertion technology, which is applied to measuring devices, measuring electricity, and measuring electrical variables, etc., can solve problems such as inaccurate test results, low test efficiency, and inability to simulate fault modes, and achieve the effect of improving the degree of automated testing

Inactive Publication Date: 2008-12-03
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The purpose of the present invention is to overcome the defects of poor operability, low test efficiency, inaccurate test effect and inability to simulate the fault mode under signal disconnection (high impedance state) in the prior art, thereby providing a product fault-tolerant test method and its fault insertion device

Method used

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  • Method for testing product fault-tolerant performance and fault inserting device thereof
  • Method for testing product fault-tolerant performance and fault inserting device thereof
  • Method for testing product fault-tolerant performance and fault inserting device thereof

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Embodiment Construction

[0039] Such as figure 1 As shown, we embed a fault signal insertion unit in the programmable chip inside the product or a dedicated chip designed by ourselves. The signal that needs to be inserted into the fault is processed by the module and then connected to the corresponding functional unit. The fault unit can interface with the chip. The input and output signals of the chip and the signals between the internal functional modules of the chip are used for fault insertion processing, but it is not limited to the use at the chip I / O pins, and can also be used for the insertion of internal signal faults of the chip, such as the internal module A of the chip and the internal The fault insertion of the interface signal between modules B can also be used to simulate the failure of some functional modules of the chip, such as phase-locked loop, business processing module, CPU communication control module, etc. inside the chip.

[0040] Such as figure 2 As shown, for chips that ca...

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Abstract

The present invention provides a product fault-tolerance test method and its fault insertion device. Said invention utilizes the production of fault analog signal to implement fault-tolerance test of product. Said method includes the following steps: setting fault insertion device in product interior, utilizing fault insertion device to produce fault analog signal with different types, utilizing CPU control interface of product interior to gate communication control module of fault insertion device, control contents of fault insertion device, control contents of control register of communication control module and selectively make fault analog signal with different types be inserted into arbitrary chip input / output pin or directly inserted into functional module of chip interior so as to simulate partial failure or complete failure of product interior unit.

Description

technical field [0001] The invention relates to reliability testing of electronic products, in particular to a product fault tolerance testing method and a fault insertion device thereof. Background technique [0002] The design of modern electronic products is becoming more and more complex, and their role in people's lives is becoming more and more important. The requirements for product reliability are becoming increasingly strict. Once a product fails, such as a high-end communication product, it will bring great harm to the user. Big loss. Therefore, the reliability design of fault tolerance in electronic products has become increasingly important, and the product fault tolerance test for product reliability design has also become increasingly important. [0003] The fault tolerance test is to simulate the failure of a certain chip inside the product, the loss of the internal clock signal, the error of the internal state signal, etc., whether the product can take corre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/00
Inventor 罗恒
Owner HUAWEI TECH CO LTD
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