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A manufacturing method of flexible laminates

A manufacturing method and technology of laminated boards, applied in the fields of printed circuit manufacturing, chemical instruments and methods, manufacturing printed circuit precursors, etc., can solve the problems of not considering the tension of laminated bodies, etc.

Inactive Publication Date: 2009-03-04
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, in JP-A-2002-192615 and JP-A-2002-370281, proper tension of the laminated body is not considered in each process.

Method used

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  • A manufacturing method of flexible laminates
  • A manufacturing method of flexible laminates
  • A manufacturing method of flexible laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] use figure 1 The thermal laminator shown produces flexible laminates. First, a roll wrapped with a non-thermoplastic polyimide film having a thickness of 125 μm having a linear expansion coefficient at 200° C. to 300° C. of 16 ppm / ° C. , a roll of copper foil having a thickness of 18 μm, and a heat-resistant adhesive film 3 wrapped with a thermoplastic polyimide resin on both sides of a core layer composed of a non-thermoplastic polyimide film The composition (glass transition temperature: 240° C.) and a roll of an adhesive film having a three-layer structure with a thickness of 25 μm were set on a thermal laminator.

[0053] Then, after these rolls were rotated, static electricity removal, foreign matter removal, and preheating were carried out, in the state where the protective film 1 was preheated for 1 / 2 turn around the pair of metal rolls 4, the heating layer shown in Table 1 was used. Lamination conditions (temperature: 360°C, linear pressure: 196N / cm, thermal ...

Embodiment 2

[0071] A flexible laminate was produced in the same manner as in Example 1 except that the tension of the laminate when peeling off the non-thermoplastic polyimide film as the protective film was 300 N / m. Then, the appearance and dimensional stability of the flexible laminate were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.

[0072] As shown in Table 1, every 1m of the flexible laminated board in Example 2 2 There is less than one wrinkle on the upper surface. In addition, the dimensional stability in the MD direction and the TD direction was respectively +0.04% (MD direction) and -0.03% (TD direction).

Embodiment 3

[0074] A flexible laminate was produced in the same manner as in Example 1 except that the tension of the laminate before peeling off the non-thermoplastic polyimide film as a protective film was 50 N / m. Then, the appearance and dimensional stability of the flexible laminate were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.

[0075] As shown in Table 1, no wrinkles were produced at all on the flexible laminated board of Example 3. In addition, the dimensional stability in the MD direction and the TD direction were respectively +0.03% (MD direction), -0.02% (TD direction ).

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Abstract

Disclosed is a method of manufacturing a flexible laminate substrate having an improved appearance and dimensional stability after removal of a metal foil. Specifically disclosed is a method of manufacturing a flexible laminate substrate 5 wherein a metal foil 2 is bonded to at least one surface of a heat-resistant adhesive film 3 . The method comprises a step wherein the heat-resistant adhesive film 3 and the metal foil 2 are thermally laminated between a pair of metal rolls 4 via a protective film 1 , thereby forming a laminate 7 wherein the heat-resistant adhesive film 3 , the metal foil 2 , and the protective film 1 are bonded together, and another step wherein the protective film 1 is removed. The tension of the laminate 7 at the time when the protective film 1 is removed is higher than the tension of the laminate 7 before the removal of the protective film 1.

Description

technical field [0001] The present invention relates to a method for manufacturing a flexible laminate, and more particularly to a method for manufacturing a flexible laminate with improved appearance and dimensional stability after metal foil removal. Background technique [0002] Conventionally, a flexible laminate in which a heat-resistant film such as a polyimide film is adhered to at least one surface of a metal foil such as copper foil has been used as a printed circuit board in electronic devices such as mobile phones. [0003] Conventionally, flexible laminates have been manufactured by bonding metal foil to a heat-resistant film with an adhesive such as acrylic or epoxy. However, in recent years, from the standpoint of heat resistance and durability, flexible laminates produced by thermally laminating heat-resistant adhesive films and metal foils without using these thermosetting adhesives have become popular. Attention. [0004] That is, since the flexible lamina...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/02B32B15/08B29C65/00B32B37/26H05K1/00H05K3/02
CPCB29C66/45H05K3/022H05K1/0393B32B2309/16B32B2311/00H05K2203/1383B29C65/18B29L2009/001B29C66/83413B32B37/26B29L2009/003B29C66/00441B29C66/83423B29C65/26B29C65/30B29C66/0242B29C66/1122B29C66/71B29C66/72321B29C66/8122B29K2905/00B29K2079/08B29C43/24B29C65/02
Inventor 菊池刚辻宏之
Owner KANEKA CORP