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Method for improving device lamination inside semiconductor plastic packer efficiently

A technology of plastic encapsulation and encapsulation method, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of functional defects, delamination and failure of semiconductor plastic encapsulation components, and improve the heat dissipation capacity. and thermal stress change resistance, delamination problem improvement, functional parameters, and the effect of reliability assurance

Active Publication Date: 2009-03-04
长电科技管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, different substances will easily cause stratification between different substances due to changes in temperature, humidity, vibration and other factors; direction or vertical direction to produce different degrees of pulling and pushing stress, and then produce delamination between different substances (such as Image 6 (a), 7(a), 8(a), and 9(a)), which eventually lead to functional defects or early failure of semiconductor plastic packaging components

Method used

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  • Method for improving device lamination inside semiconductor plastic packer efficiently
  • Method for improving device lamination inside semiconductor plastic packer efficiently
  • Method for improving device lamination inside semiconductor plastic packer efficiently

Examples

Experimental program
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Effect test

Embodiment 1

[0018] see figure 1 , the present invention effectively improves the packaging method for delamination of components in the semiconductor plastic package. In the semiconductor plastic package, an anchor hole 3 is made on the metal lead frame 1 to allow the epoxy resin molding compound to penetrate. The metal layer 4 is partially plated on the surface of the metal lead frame 1 bonded with the resin molding compound 2 .

Embodiment 2

[0020] see figure 2 , Embodiment 2 is based on Embodiment 1, and a rough surface 5 is made on the surface of the metal lead frame 1 combined with the epoxy resin molding compound 2 .

[0021] see image 3 , image 3 It is a schematic diagram of a typical complete plastic package structure.

[0022] see Figure 4 , 5 , 6, Figure 4 , 5 , 6 are force comparison diagrams of the bonding surface between the metal lead frame and the epoxy resin molding compound before and after the improvement of the present invention.

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PUM

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Abstract

A packing method to avoid delamination of the elements in semi-conducting package includes: making anchor eye on the surface of the lead frame getting through the epoxy resin package; plating on the surface with metal layer.

Description

Technical field: [0001] The invention relates to a component in a semiconductor plastic package, in particular to a package method for effectively improving the delamination of components in a semiconductor plastic package. It belongs to the technical field of semiconductor packaging. Background technique: [0002] Semiconductor plastic packaging components basically use a combination of various materials, and the materials mainly include metal lead frame, epoxy resin, metal wire, polymer adhesive, metal coating and so on. However, different substances will easily cause stratification between different substances due to changes in temperature, humidity, vibration and other factors; direction or vertical direction to produce different degrees of pulling and pushing stress, and then produce delamination between different substances (such as Figure 6 (a), 7(a), 8(a), and 9(a)), which eventually lead to functional defects or early failure of semiconductor plastic packaging com...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/31
CPCH01L2224/48091H01L2224/73265H01L2224/32245H01L2924/18301H01L2224/48247H01L2924/00014H01L2924/00
Inventor 梁志忠王新潮于燮康茅礼卿潘明东陶玉娟闻荣福周正伟李福寿
Owner 长电科技管理有限公司