Wiring structure for coupling chip

Abstract

A wiring structure used on coupled chip consists of a unit including multiple circuit being set in parallel to each other and being extended towards the second direction, multiple conductive pad being set on said circuits separately. It is featured as arranging adjacent conductive pads in sequence on the first direction but alternatively to each other on the second direction, setting said multiple circuit in corresponding to its adjacent pads and arranging an offset unit being towards to the first direction far away from said conductive pad on multiple circuit.

Description

technical field [0001] The invention relates to a wiring structure for coupling chips, in particular to a wiring structure which can ensure electrical conduction with the chip under the precision of existing machines, thereby reducing the size of the chip. Background technique [0002] Due to the advantages of power saving, light weight, low radiation and easy portability, liquid crystal displays (Liquid Crystal Displays, LCDs) have gradually replaced traditional displays and become the mainstream of the display market. Among them, in addition to key components such as backlight modules, liquid crystals, and color filters, liquid crystal displays also convert external signals into control signals through integrated circuit chips and wiring structures on the panel, and then determine the brightness of each pixel. [0003] Known liquid crystal display 10 such as figure 1 As shown, a wiring structure 13 is formed on the glass substrate 11, and at the lowermost edge of the glas...

AI Technical Summary

Problems solved by technology

From a process point of view, in order to reduce the size, the distance between the lines 131 or between the conductive pads 133 should be as small as possible. The larger the distance between the better, these two indicators are usually contradictory and difficult to choose

In actual design and manufacturing, the distance between the conductive pad 133 and the circuit 131 will be estimated according to the machine capacity, incoming material error, and the manufacturer's self-assessed process stability standards, etc., which will also affect the design size of the integrated circuit chip 15

[0007] In the existing process, limited by the stability of the machine and its process capability, the occupied area of ​​the integrated circuit chip 15 is too large, and the display area is compressed, which is not conducive to product miniaturization

If you want to use a smaller integrated circuit chip 15, you must use a higher-precision flip-chip machine, which will increase the manufacturing cost

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