Image sensor module with real protection flange, and fabricating method thereof
A technology of image sensors and protective flanges, which is applied in semiconductor/solid-state device manufacturing, image communication, electric solid-state devices, etc., and can solve the problems of different module sizes, waste, and easy-to-contaminate chips
Inactive Publication Date: 2009-04-22
KINGPAK TECH INC
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] However, in the above-mentioned image sensor module, when the adhesive 26 is applied, the amount of the adhesive 26 is not controlled properly, which also causes the adhesive 26 to expose the lens holder 28, so that the manufactured modules are of different sizes, so they must be scrapped with a large size. of modules, while forming a waste
And the adhesive 26 is easy to pollute the chip 20, which affects the quality of the product
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0019] see figure 2 , is a schematic diagram of an image sensor module with a protective flange of the present invention, which includes a substrate 40, a chip 42, a plurality of wires 44, an adhesive 46, a lens holder 48 and a lens barrel 50:
[0020] The substrate 40 has an upper surface 52 and a lower surface 54 , the upper surface 54 is formed with a first electrode 56 , and the lower surface 54 is formed with a second electrode 58 connected to the corresponding first electrode 56 .
[0021] The chip 42 is disposed on the upper surface 52 of the substrate 40 , and a sensing area 60 and a bonding pad 62 are formed thereon.
[0022] The plurality of wires 44 are electrically connected to the pads 62 of the chip 42 and the first electrodes 56 of the substrate 40 .
[0023] The adhesive 46 is an adhesive, which is coated on the upper surface 52 of the substrate 40 and located around the first electrode 56 .
[0024] The mirror base 48 is provided with a side wall 63, an ann...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The image sensor module includes following parts: a basal plate with an upper surface and a lower surface; first electrode formed on the upper surface, and second electrode formed on the lower surface and connected to corresponding first electrode; a chip setup on upper surface of the basal plate; sensing area and weld pads formed on the chip; wires connect weld pads of chip to first electrode on the basal plate; adhesion agent is coated on upper surface of the basal plate; a lens seat contains ringed protective flange, and internal thread. When using adhesion agent sets up sidewall of the lens seat on the upper surface, the ringed protective flange just surrounds sensing area of the chip so as to prevent the chip from pollution of the adhesion agent. External thread on lens barrel is matched and locked to internal thread on the lens seat.
Description
technical field [0001] The invention relates to a miniaturized image sensor module and a manufacturing method thereof, in particular to an image sensor module that can effectively improve the yield rate and make the product lighter, thinner and shorter. Background technique [0002] see figure 1 , is a cross-sectional view of an image sensor module structure, which includes; a substrate 10 is provided with an upper surface 12 and a lower surface 14, the upper surface 12 is formed with a first electrode 16, and the lower surface 14 is formed with a second electrode 18 to connect The corresponding first electrode 16; the chip 20 is arranged on the upper surface 12 of the substrate 10, on which a pad 22 is formed; a plurality of wires 24 are electrically connected to the pad 22 of the chip 20 to the first electrode 16 of the substrate 10; The adhesive 26 is coated on the upper surface 12 of the substrate 10; a mirror holder 28 is provided with an internal thread 30, and the ch...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H01L21/50H04N5/225
CPCH01L2224/8592H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 杜修文彭镇滨何孟南谢尚锋辛宗宪
Owner KINGPAK TECH INC