Method for improving the line precision in the etching technology

Abstract

A method for improving the accuracy of lines in the etching process. First, measure the thickness of the coating on the substrate to be electroplated to obtain the graphics of the distribution area of ​​different coating thicknesses on the substrate. Then, select a substrate with a coating and perform preliminary etching by uniform compensation. Obtain an initial circuit pattern on the substrate, and optimize the line width and line spacing in the best distribution area on the initial circuit pattern on this initial circuit pattern; take the optimized line width and line spacing value as the reference value and bring it into Combence In the formula, calculate the line width and line spacing value in each distribution area on the initial line graph as the setting value of etching line width and line spacing in each distribution area, and use the method of non-uniform compensation to set the value for each etching line width and line spacing respectively. Formal etching is performed on the distribution areas of different coating thicknesses to obtain formal circuit patterns on the substrate coating. Applied in the manufacturing process of high-density interconnected printed circuit boards and IC packaging substrates, it can reduce the etching deviation of the line width and obtain a relatively uniform official circuit pattern.

Description

technical field [0001] The present invention relates to a method for improving line precision, in particular to a method for improving line precision in etching patterns in an etching process. Etching process for high density interconnection (HDI) printed circuit boards and IC packaging substrates. Background technique [0002] In the manufacturing process of high density interconnection (HDI) printed circuit boards and IC package carriers, the etching (Etching) process is a very important step. The quality of the etching process directly affects the quality of HDI printed circuit boards and IC packaging substrates and the high density of wiring. The so-called etching process is to chemically remove the unwanted metal layer (usually a copper layer) on the substrate with an etching solution to form the required circuit pattern, and as the circuit metal layer in the circuit pattern, photosensitive pattern transfer is usually used. Or screen printing method to cover its surfa...

AI Technical Summary

Problems solved by technology

However, due to the high cost of the newly designed electroplating line, and its stability needs to be further improved, most HDI and IC packaging substrate factories currently use conventional equipment for production, and the thickness of the electroplating layer is the same as the entire board. The extreme difference is about in the range of 2 microns to 4 microns

[0005] To sum up, due to the side erosion phenomenon during the etching process and the non-uniformity of the thickness of the electroplating layer, when the same compensation conditions are used for the entire board, the circuit of the entire board (HDI printed circuit board and IC packaging substrate) , the line width and line spacing of each unit will vary with the thickness of the above-mentioned plating layer, which will cause uneven line parameters on each entire board (HDI printed circuit board or IC packaging substrate), seriously affect product yield

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