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Method for reducing light decay of light emitting diode

A technology of light-emitting diodes and light decay, which is applied to electrical components, circuits, semiconductor devices, etc., to achieve the effects of reducing light decay, low cost, and improving serious light decay

Inactive Publication Date: 2009-07-22
RUGAO DACHANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, light decay has become an important bottleneck limiting the application of light-emitting diodes

Method used

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  • Method for reducing light decay of light emitting diode
  • Method for reducing light decay of light emitting diode

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Embodiment Construction

[0014] The method for reducing the light decay of LED disclosed by the present invention is mainly to form a layer of light-transmitting medium above the light-emitting surface of the light-emitting diode grain, and the light-transmitting medium is composed of the first component, the second Formed by compounding components, wherein the first component is polydimethylsiloxane, and the second component is mainly composed of dimethylsiloxane, methylhydrogensiloxane and vinyl silicon Copolymers of oxanes ( ), also contains r-(2,3-glycidoxy) propyltrimethoxysilane (r-glycidyl ether propyltrimethoxysilane) (molecular structure: ) and triethoxymethylsiloxane (molecular structural formula: ). The weight content of the copolymer in the second component is 94% to 99% (preferably 98% in this embodiment), and the weight content of dimethylsiloxane is 84% ​​to 90% (preferably 98% in this embodiment) 87%), the weight content of methylhydrogen siloxane is 4% to 9% (preferably 7% in th...

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Abstract

The invention discloses a method to decrease the luminous decay of light emitting diodes, is characterized in that a translucid medium layer is formed above the light exit surface of grains in light emitting diodes; the translucid medium is formed by blending the first component and the second component; the first component is poly (dimethylsiloxane), and the second component mainly consists of copolymer formed by dimethylsiloxane, methylhydrosiloxane and vinyl siloxane; in the second component the weight compositions of the copolymer is 94 to 99 percent, and the weight compositions of dimethylsiloxane is 84 to 90 percent by weight of the copolymer, 4 to 9 percent by weight of methylhydrosiloxane, and 2 to 7 percent by weight of vinyl siloxane.

Description

【Technical field】 [0001] The invention relates to a light-emitting diode, more specifically, to a method for reducing light decay of the light-emitting diode. 【Background technique】 [0002] Light-emitting diode is a semiconductor light-emitting device, which is widely used as indicator lights, display screens, etc. Light-emitting diodes are known as the fourth-generation lighting source to replace fluorescent lamps and incandescent lamps. The theoretical lifespan of light-emitting diodes is about 100,000 hours. However, when the light-emitting diodes emit light after receiving positive and negative voltages at both ends, they will generate a certain amount of heat. If the heat is not conducted out quickly, it will heat up around the chip. On the one hand, the temperature is higher than the junction temperature of the chip, so that the chip itself fails; The light will be absorbed by the yellowed insulating glue (silver glue) or the resin or phosphor material encapsulated ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00C08L83/14C08K5/54
Inventor 占贤武
Owner RUGAO DACHANG ELECTRONICS