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Wiring method and system

A wiring method and wiring system technology, applied in the field of wiring and systems, can solve the problems of low utilization of wiring space, stray setting positions of through holes, and low wiring density, so as to improve the neatness and aesthetics and increase the wiring space , The effect of improving wiring efficiency

Inactive Publication Date: 2009-07-22
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the above wiring method, in addition to complying with the minimum spacing requirements of the wiring rules, there is no regulation on the location and number of through holes, so the following situation often occurs: due to the lack of reasonable and systematic layout, The number of through-holes is complicated and there is no certain arrangement rule, which is messy and disorderly. Relatively, the space utilization of wiring is low, which will limit the space that can be wired, resulting in low wiring density.
[0004] At the same time, due to the complexity and disorder of the through holes, if it is necessary to adjust the existing wiring, it is necessary to readjust the set position of each through hole according to the wiring situation, and the workload of the reset is different from that of the through holes involved. The number and location are closely related, so it will undoubtedly greatly increase the workload and affect the wiring efficiency
[0005] In addition, in the above wiring design, the setting positions of the through holes are relatively scattered and messy, and the number of setting is not systematically regulated, so the orderliness of each through hole is poor, which further affects the appearance of the circuit pattern

Method used

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specific Embodiment

[0044] see image 3, which is a schematic diagram showing a structural model of an electronic component of the wiring method of the present invention.

[0045] In this embodiment, the circuit board has a ball grid array (BGA) wiring area, and the wiring area has a multi-regular array of pads. In this embodiment, the through holes are arranged on the same reference line, and the distances between the through holes (marked by V1, V2) and the corresponding pads (marked by A1, A2) are all equal in length, and The position range of the through hole is determined according to the minimum distance allowed by the through hole and the pad in the wiring rule. Specifically, assuming that the minimum distance allowed by the through hole and the pad of the wiring rule is 6 mils (mil), then the distances X1, X2 from the through hole V1 to the pads A1 and A2 are at least 6 mils ( mil); if the radius of the pad is r1, the radius of the through hole is r2 (let the pad and the through hole be...

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Abstract

The present invention relates to a wiring method and a system, which is used for the electric circuit pattern of a plurality of pad (Pad), a via (Via) and a trace (Trace) arranged on a circuit board, wherein the electric circuit pattern is equipped with a wiring rule in advance; the wiring method is mainly based on the wiring rule, the via is arranged at an identical reference line first, the distance of the via off the corresponding pad is equal, the position of the circuit is adjusted according to the circuit wiring condition and the wiring rule, the position of the via is adjusted at the reference line relatively, thereby the wiring space with a good flexibility can be provided, and the wiring space can be increased relatively.

Description

technical field [0001] The present invention relates to a wiring method and system, more specifically, relates to a wiring method applied to a circuit pattern (pattern) of a ball grid array (BGA) wiring area on a circuit board and system. Background technique [0002] Generally, a wiring design needs to be carried out on a printed circuit board so that each component provided on the printed circuit board is electrically connected and functions. Taking the circuit board of a notebook computer as an example, its size is getting smaller and smaller due to the miniaturization trend of electronic devices, and the space for wiring on the circuit board is very limited, especially for the spherical shape of the circuit board. As far as the wiring area of ​​the Ball GridArray (BGA) is concerned, it is difficult to design wiring in such a small space. At present, in the existing layout (Layout) design, electronic engineers complete it through various layout software programs (such a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 韩冰周俊良
Owner INVENTEC CORP