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Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus

A manufacturing method and substrate technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, semiconductor/solid-state device manufacturing, etc., to achieve the effect of low price

Inactive Publication Date: 2009-08-05
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that it is necessary to perform a process of filling the intermediate material and drying it.

Method used

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  • Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus
  • Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus
  • Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] (Embodiment 1)

[0017] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. figure 1 It is a flowchart of the manufacturing method of the laminated board|substrate of Embodiment 1 of this invention. in addition, figure 1 The various manufacturing processes shown are based on the following figure 2 and figure 2 Later explanations will make it clearer.

[0018] see figure 1, the process of preparing the substrate 101, the flux 112, and applying the flux 111 is shown first. Flux coating 111 is, for example, a conductive process for printing flux 112 onto one main surface 101a of the substrate 101 with a metal screen (not shown) in order to mount the semiconductor element 105 on one main surface 101a of the substrate 101. Manufacturing process on part (bond pattern).

[0019] The paste solder printing step 113 is a step of printing paste solder 2 on another land pattern using a screen to mount the resistor 106 on ...

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PUM

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Abstract

The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.

Description

technical field [0001] The present invention relates to a method of manufacturing a laminated substrate used in portable electronic devices requiring miniaturization, a semiconductor element for a package used in the method, and manufacturing equipment of the laminated substrate. Background technique [0002] A conventional method of manufacturing a laminated substrate will be described with reference to the drawings. from Figure 34 to Figure 39 The manufacturing process of the conventional laminated board|substrate is shown. Figure 34 It is a flowchart showing a conventional manufacturing process of a laminated substrate. exist Figure 34 Among them, the conventional method for manufacturing a laminated board includes paste solder printing 3 for printing paste solder 2 on a substrate 1 and electronic component mounting 5 for mounting electronic components 4 . In addition, a reflow soldering 6 and a device 8 for mounting a semiconductor element 7 are provided. In addit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/00H05K13/00B32B3/00H01L21/56H01L23/31H01L23/538H05K1/18H05K3/28
CPCH05K3/4652H01L2924/19105H05K2203/063H01L23/3121H01L2924/01078H01L2924/19041H01L21/56H01L2224/73204H01L2224/16225H05K3/284H01L2924/3025H05K1/186H01L2924/3511Y10T428/24917
Inventor 西村干夫森敏彦本城和彦木村润一西井利浩原田真二北川元祥
Owner PANASONIC CORP