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Dibit dielectric memory unit array and method for detecting charge stored in the array

A technology of memory unit and dielectric, applied in the field of flash memory unit device, can solve the problems of current, incorrect reading, etc.

Inactive Publication Date: 2009-08-19
CYPRESS SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, even a small voltage difference between bit line 26c and bit line 26d may cause current flow and incorrectly read

Method used

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  • Dibit dielectric memory unit array and method for detecting charge stored in the array
  • Dibit dielectric memory unit array and method for detecting charge stored in the array
  • Dibit dielectric memory unit array and method for detecting charge stored in the array

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Embodiment Construction

[0028] The present invention will now be described in detail with reference to the accompanying drawings. In the various drawings, the same reference numerals are used to denote the same components. In addition, the drawings are not drawn to scale, and the sizes of some fine structures are deliberately drawn larger for the purpose of clarity.

[0029] figure 2 An exemplary embodiment of a dual-bit dielectric memory cell array 40 is shown in block diagram form. Array 40 includes a plurality of dual-bit dielectric memory cells 48 fabricated on a crystalline semiconductor substrate, an array control circuit 61 , and a current sensing circuit 66 . The array of 2-bit dielectric memory cells 48 is arranged in a matrix with horizontal columns of polysilicon wordlines 210 - 213 within substrate 42 , and vertical rows of bitline diffusion regions 200 - 205 alternating with channel regions 50 . Each memory cell 48 in a row shares the same channel region 50 with other memory cells 48...

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Abstract

A method of detecting charge stored in a charge storage region (62) of a first dual-bit dielectric memory cell (49) within an array (40) of dual-bit dielectric memory cells (48), comprising combining a charge with the first memory cell ( The channel region (50) of 49) forms a source junction for the first bit line (201), coupled to the ground line (68). A high voltage is applied to the gate (60) of the first memory cell (49) and the second bit line (202), which is the next bit line to the right of the first bit line (201), and only through the channel region (50) is separated from the first bit line (201). The third bit line (203), which is the next bit line to the right of the second bit line (202), is isolated so that its potential is only affected by its second channel region (50) on the opposite side of the third bit line (203). ) and the junction between the third channel region (50). A high voltage is applied to the pre-charged bit line, located to the right of the third bit line (203), and the current on the second bit line (202) is sensed to determine the source bit (62) of the first memory cell (49) ) programming status.

Description

technical field [0001] The present invention relates to flash memory cell devices, and more particularly, to improvements in pre-charge read methods to read charges previously stored in a dielectric memory cell structure of a dual-bit dielectric memory cell. Background technique [0002] A common type of floating-gate flash memory, electrically erasable programmable read only memory (EEPROMs), utilizes a memory cell characterized by a tunnel oxide (SiO 2 ), a polysilicon floating gate on the tunnel oxide, an interlayer dielectric (typically oxide, nitride, oxide stack) on the floating gate, and a control gate on the interlayer dielectric Stack vertically. Within the substrate, there is a channel region under the vertical stack, and source and drain diffusion regions on opposite sides of the channel region. [0003] The floating gate flash memory cell generates a non-volatile negative charge on the floating gate by inducing hot electron injection from the channel region to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C7/12G11C16/24G11C16/04
CPCG11C16/24G11C16/0475G11C7/12G11C5/025G11C8/08G11C16/08
Inventor Y·何Z·刘M·W·兰多夫E·F·朗尼恩D·汉米尔顿P-L·陈B·Q·李
Owner CYPRESS SEMICON CORP