Packaging structure and its manufacturing method
A packaging structure and substrate technology, applied in the direction of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid device manufacturing, etc., can solve the problem of increasing the volume of the packaging structure 100, increasing the material cost of the packaging structure 100, and the inability of the packaging structure 100 to be flexible Bending and other problems, achieve the effect of volume reduction and save purchase cost
Active Publication Date: 2009-09-09
ADVANCED SEMICON ENG INC
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Problems solved by technology
In this way, the dam 150 not only increases the material cost of the packaging structure 100, but also increases the volume of the packaging structure 100, and the hard substrate 110 makes the packaging structure 100 unable to be elastically bent in the small space of the electronic device.
Method used
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[0016] Please refer to figure 2 , which is a schematic diagram of a package structure according to a preferred embodiment of the present invention. The packaging structure 200 includes a flexible substrate 10 and a photosensitive chip 20 . The photosensitive chip 20 may be any type of chip. In this embodiment, the photosensitive chip 20 is described by taking a contact image sensor (CMOS Image sensor, CIS) as an example. The photosensitive chip 20 is directly disposed on the flexible substrate 10 and is electrically connected to the flexible substrate 10 .
[0017] The flexible substrate 10 has a substrate surface 10a, and the substrate surface 10a has at least one first substrate bonding pad 11, here two first substrate bonding pads 11 are taken as an example for illustration. The photosensitive chip 20 includes a body portion 21 and at least one conductive post 22 . The body portion 21 has an active surface 21 a and a back surface 21 b opposite to each other, and the act...
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The invention relates to a package structure and a method for manufacturing the same, wherein the package structure comprises a soft substrate and a photosensitive chip; the soft substrate has a substrate surface with a substrate welding pad; the photosensitive chip comprises a body part and a conductive column; the body part has an active surface and a non-active surface opposite to each other; the active surface has a photosensitive region and a chip joint pad which are in electrical connection; the non-active surface is glued to the substrate surface; the conductive column is arranged inside the body part and passes through the active surface and the non-active surface; moreover, the conductive column has a first end and a second end; the first end is in electrical connection with the chip joint pad, while the second end is in electrical connection with the substrate welding pad. The package structure and the manufacturing method not only save package cost, but also reduce the volume of the package structure.
Description
technical field [0001] The present invention relates to a packaging structure and a manufacturing method thereof, and in particular to a packaging structure in which a photosensitive chip is embedded with conductive posts and a manufacturing method thereof. Background technique [0002] Semiconductor packaging technology is developing rapidly. Various chips can be protected and protected from moisture through packaging technology, and the internal wires of the chip are electrically connected to the wires of the printed circuit board. However, for a photosensitive chip, it is more necessary to have a good packaging technology to protect its photosensitive area, so as to avoid the photosensitive area from being polluted by particles. As for the conventional packaging structure with photosensitive chips, a brief description is given in the accompanying drawings as follows. [0003] Please refer to figure 1 , which shows a schematic diagram of a conventional packaging structur...
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IPC IPC(8): H01L23/488H01L21/60H01L31/0203H01L31/18
CPCH01L2224/48091H01L2924/16195Y02P70/50H01L2924/00014
Inventor 萧伟民杨国宾
Owner ADVANCED SEMICON ENG INC