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Radiating apparatus

A heat dissipation device and heat sink technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problem of increased airflow resistance, failure to fully utilize radiators for heat dissipation, and affecting airflow and heat dissipation of heat sinks. Exchange effect and other issues to achieve good heat dissipation performance, improve heat dissipation performance, and increase heat dissipation area

Inactive Publication Date: 2009-10-28
FU ZHUN PRECISION IND SHENZHEN +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the airflow generated by the fan blows onto the base, the airflow is blocked and rebounds, which increases the flow resistance of the airflow and affects the heat exchange between the airflow and the heat sink.
In addition, very little of the airflow generated by the fan can blow to the part of the radiator located under the fan hub, that is, the part of the radiator located under the fan hub is not fully utilized for heat dissipation

Method used

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  • Radiating apparatus
  • Radiating apparatus
  • Radiating apparatus

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Embodiment Construction

[0013] see Figures 1 to 2 , discloses a heat dissipation device according to an embodiment of the present invention. The heat dissipation device includes a heat conducting plate 100, a heat sink 200 disposed on the heat conducting plate 100, a fan 300 fixed on the top of the heat sink 200 through a plurality of fan fixing frames 310, and a heat dissipation element disposed on one side of the heat sink 200. 400 and a heat conduction element such as three heat pipes 500. The three heat pipes 500 thermally connect the heat conducting plate 100 , the radiator 200 and the heat dissipation element 400 . The fan 300 includes a hub 320 and a plurality of blades 330 radially extending from the hub 320 .

[0014] The heat conducting plate 100 is in contact with electronic components such as a central processing unit and absorbs heat generated by them. The heat conduction plate 100 is made of a material with good heat conduction performance, such as metal copper or aluminum, and thre...

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Abstract

A heat dissipation device, comprising a heat conduction plate in contact with electronic components, a heat sink disposed on the heat conduction plate, a fan disposed on the heat sink, a heat dissipation element and a heat pipe, the heat pipe connects the heat conduction plate, heat dissipation The radiator and the heat dissipation element are thermally connected. The radiator includes a heat conduction column corresponding to the heat conduction plate and located below the fan, and a number of sheet-shaped fins arranged on the heat conduction column. The heat conduction column is rectangular, and its four corners are respectively outward. Extend to form an extension arm, these fins extend outward from the heat conduction column and its extension arm, the opposite sides of the heat dissipation element are respectively provided with a groove, the heat dissipation device also includes another fan and fixes the other fan A pair of fan fixing brackets on the cooling element, each fan fixing bracket includes a mounting portion for the other fan to be installed, an extension connecting the mounting portion and inserted into the groove of the cooling element, and connecting the mounting portion and abutting against the heat dissipation The catch on the top of the component.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device applied to electronic components. Background technique [0002] Electronic components (such as central processing unit) generate a lot of heat during operation, which increases the temperature of itself and the system, which in turn leads to a decrease in its operating performance. In order to ensure the normal operation of the electronic components, a cooling device is usually installed on the electronic components to dissipate the heat generated by them. [0003] A traditional cooling device generally includes a heat sink in contact with electronic components and a fan arranged on top of the heat sink. The radiator includes a base and a plurality of cooling fins arranged on the base. The fan includes a hub and several blades radially extending outward from the hub. The airflow generated by the fan blows down over the heat sink and exchanges heat with the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/34G06F1/20H05K7/20
Inventor 赵良辉吴宜强陈俊吉
Owner FU ZHUN PRECISION IND SHENZHEN
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